Microstructural evolution and mechanical properties of SnAgCu alloys
Language
en
Article de revue
This item was published in
Journal of Applied Physics. 2006, vol. 100, n° 4, p. 043519
American Institute of Physics
English Abstract
Lead containing solder paste is now considered as an environmental threat. In order to eliminate this undesirable environmental impact associated to their production, a family of lead-free solder joint, Sn-3.8Ag-0.7Cu, is ...Read more >
Lead containing solder paste is now considered as an environmental threat. In order to eliminate this undesirable environmental impact associated to their production, a family of lead-free solder joint, Sn-3.8Ag-0.7Cu, is proposed. Microstructural and mechanical data of this solder joint have been acquired and compared with the most common used SnPb solder paste. The evolution of the microstructure as well as the failure mode and the mechanical properties of SnAgCu solder joint are discussed as a function of strain rate, annealing treatments, and testing temperature. Tensile tests have been performed, at temperatures ranging from –50 to +150 °C, on bulk samples. Changes of the mechanical properties of bulk tested samples are actually correlated with microstructural changes, as shown by transmission electronic microscopy investigations.Read less <
English Keywords
SnAgCu alloys
Mechanical properties
Heat and thermomechanical treatments
Deformation
plasticity
and creep
Origin
Hal imported