FOUASSIER, Olivier; HEINTZ, Jean-Marc; CHAZELAS, J.; GEFFROY, Pierre-Marie; SILVAIN, Jean-François

doi:10.1063/1.2244478

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FOUASSIER, Olivier
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]

HEINTZ, Jean-Marc
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]

CHAZELAS, J.
THALES Airborne Systems [Elancourt]

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Journal of Applied Physics. 2006, vol. 100, n° 4, p. 043519

American Institute of Physics

Résumé en anglais

Lead containing solder paste is now considered as an environmental threat. In order to eliminate this undesirable environmental impact associated to their production, a family of lead-free solder joint, Sn-3.8Ag-0.7Cu, is proposed. Microstructural and mechanical data of this solder joint have been acquired and compared with the most common used SnPb solder paste. The evolution of the microstructure as well as the failure mode and the mechanical properties of SnAgCu solder joint are discussed as a function of strain rate, annealing treatments, and testing temperature. Tensile tests have been performed, at temperatures ranging from –50 to +150 °C, on bulk samples. Changes of the mechanical properties of bulk tested samples are actually correlated with microstructural changes, as shown by transmission electronic microscopy investigations.< Réduire

Mots clés en anglais

SnAgCu alloys

Mechanical properties

Heat and thermomechanical treatments

Deformation

plasticity

and creep

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Microstructural evolution and mechanical properties of SnAgCu alloys

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