Structural and thermal properties of hot pressed Cu/C matrix composites materials used for the thermal management of high power electronic devices
Langue
en
Article de revue
Ce document a été publié dans
Materials Science Forum. 2007, vol. 534-536, p. 1505-1508
Trans Tech Publications Inc.
Résumé en anglais
In order to obtain materials for electronic applications that exhibit both excellent thermal conductivity and low coefficient of thermal expansion (CTE), copper matrix composites have been reinforced by short high modulus ...Lire la suite >
In order to obtain materials for electronic applications that exhibit both excellent thermal conductivity and low coefficient of thermal expansion (CTE), copper matrix composites have been reinforced by short high modulus graphite fibers. The lack of fiber/matrix interaction prevents any degradation of the carbon reinforcement during the elaboration steps and the normal use of these materials.< Réduire
Mots clés en anglais
Hot pressing
Copper/carbon composite
Thermal management
CTE
Origine
Importé de halUnités de recherche