Structural and thermal properties of hot pressed Cu/C matrix composites materials used for the thermal management of high power electronic devices
| hal.structure.identifier | Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB] | |
| dc.contributor.author | GEFFROY, Pierre-Marie | |
| hal.structure.identifier | Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB] | |
| dc.contributor.author | SILVAIN, Jean-François | |
| dc.date.issued | 2007 | |
| dc.identifier.issn | 0255-5476 | |
| dc.description.abstractEn | In order to obtain materials for electronic applications that exhibit both excellent thermal conductivity and low coefficient of thermal expansion (CTE), copper matrix composites have been reinforced by short high modulus graphite fibers. The lack of fiber/matrix interaction prevents any degradation of the carbon reinforcement during the elaboration steps and the normal use of these materials. | |
| dc.language.iso | en | |
| dc.publisher | Trans Tech Publications Inc. | |
| dc.subject.en | Hot pressing | |
| dc.subject.en | Copper/carbon composite | |
| dc.subject.en | Thermal management | |
| dc.subject.en | CTE | |
| dc.title.en | Structural and thermal properties of hot pressed Cu/C matrix composites materials used for the thermal management of high power electronic devices | |
| dc.type | Article de revue | |
| dc.identifier.doi | 10.4028/www.scientific.net/MSF.534-536.1505 | |
| dc.subject.hal | Chimie/Matériaux | |
| bordeaux.journal | Materials Science Forum | |
| bordeaux.page | 1505-1508 | |
| bordeaux.volume | 534-536 | |
| bordeaux.peerReviewed | oui | |
| hal.identifier | hal-00122560 | |
| hal.version | 1 | |
| hal.popular | non | |
| hal.audience | Internationale | |
| hal.origin.link | https://hal.archives-ouvertes.fr//hal-00122560v1 | |
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