Elaboration by tape casting and hot rolling of copper/silicon carbide composite thin films for microelectronic applications
hal.structure.identifier | Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB] | |
dc.contributor.author | GEFFROY, Pierre-Marie | |
hal.structure.identifier | Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB] | |
dc.contributor.author | SILVAIN, Jean-François | |
hal.structure.identifier | Axe 1 : procédés céramiques | |
dc.contributor.author | CHARTIER, Thierry | |
dc.date.issued | 2007 | |
dc.identifier.issn | 0255-5476 | |
dc.description.abstractEn | During the last decade, the use of metal matrix composites (MMCs) materials such as Al/SiC or CuW for microelectronic devices have made powder modules more reliable. | |
dc.language.iso | en | |
dc.publisher | Trans Tech Publications Inc. | |
dc.subject.en | Thermal conductivity | |
dc.subject.en | Composites | |
dc.subject.en | Hot rolling | |
dc.subject.en | Tape casting | |
dc.subject.en | CTE | |
dc.title.en | Elaboration by tape casting and hot rolling of copper/silicon carbide composite thin films for microelectronic applications | |
dc.type | Article de revue | |
dc.identifier.doi | 10.4028/www.scientific.net/MSF.534-536.881 | |
dc.subject.hal | Chimie/Matériaux | |
bordeaux.journal | Materials Science Forum | |
bordeaux.page | 881-884 | |
bordeaux.volume | 534-536 | |
bordeaux.peerReviewed | oui | |
hal.identifier | hal-00122590 | |
hal.version | 1 | |
hal.popular | non | |
hal.audience | Internationale | |
hal.origin.link | https://hal.archives-ouvertes.fr//hal-00122590v1 | |
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