Elaboration by tape casting and hot rolling of copper/silicon carbide composite thin films for microelectronic applications
Idioma
en
Article de revue
Este ítem está publicado en
Materials Science Forum. 2007, vol. 534-536, p. 881-884
Trans Tech Publications Inc.
Resumen en inglés
During the last decade, the use of metal matrix composites (MMCs) materials such as Al/SiC or CuW for microelectronic devices have made powder modules more reliable.
Palabras clave en inglés
Thermal conductivity
Composites
Hot rolling
Tape casting
CTE