Elaboration by tape casting and hot rolling of copper/silicon carbide composite thin films for microelectronic applications
Langue
en
Article de revue
Ce document a été publié dans
Materials Science Forum. 2007, vol. 534-536, p. 881-884
Trans Tech Publications Inc.
Résumé en anglais
During the last decade, the use of metal matrix composites (MMCs) materials such as Al/SiC or CuW for microelectronic devices have made powder modules more reliable.
During the last decade, the use of metal matrix composites (MMCs) materials such as Al/SiC or CuW for microelectronic devices have made powder modules more reliable.< Réduire
Mots clés en anglais
Thermal conductivity
Composites
Hot rolling
Tape casting
CTE
Origine
Importé de halUnités de recherche