CONSTANTIN, Loïc; FAN, Lisha; PONTOREAU, Mael; WANG, Fei; CUI, Bai; BATTAGLIA, Jean-Luc; SILVAIN, Jean-François; LU, Yong Feng

doi:10.1016/j.mfglet.2020.03.014

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CONSTANTIN, Loïc
University of Nebraska–Lincoln
Department of Electrical and Computer Engineering
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]

FAN, Lisha
University of Nebraska–Lincoln
Department of Electrical and Computer Engineering

PONTOREAU, Mael
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]

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Manufacturing Letters. 2020-04, vol. 24, p. 61-66

Elsevier

Résumé en anglais

Copper (Cu)/diamond (D) composites have excellent thermal properties but are hard to manufacture with conventional methods. Additive manufacturing (AM) can overcome this issue because of its high degree of freedom to fabricate complex designs. In this letter, we demonstrate the laser directed energy deposition of Cu/D composites. D particles were coated with graded TiO2-TiC interphase to enhance its wettability with molten Cu. A relatively dense Cu/25 vol% coated-D composite was printed (96%) at an energy density of 1200 J/mm3 (power = 900 W, scan = 12.7 mm/s) with high thermal conductivity (330 W/m.K), and no graphitization of the D.< Réduire

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Additive manufacturing

composites

copper

diamond

interphase

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Additive manufacturing of copper/diamond composites for thermal management applications

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