TAN, Zhanqiu; JI, Gang; ADDAD, Ahmed; LI, Zhiqiang; SILVAIN, Jean-François; ZHANG, Di

doi:10.1016/j.compositesa.2016.09.012

Métadonnées

Afficher la notice complète

Licence d’utilisation du document

TAN, Zhanqiu
State Key Laboratory of Metal Matrix Composites

JI, Gang
Unité Matériaux et Transformations - UMR 8207 [UMET]

ADDAD, Ahmed
Unité Matériaux et Transformations - UMR 8207 [UMET]

Langue

Article de revue

Ce document a été publié dans

Composites Part A: Applied Science and Manufacturing. 2016, vol. 91, Part 1, p. 9-19

Elsevier

Résumé en anglais

Interfacial configurations of the diamond/Al composites fabricated by vacuum hot pressing (VHP) and spark plasma sintering (SPS) have been investigated to evaluate feasibility of both techniques for tailoring interfacial bonding states, namely non-bonded, diffusion-bonded, partially and fully reaction-bonded interfaces. Multiscale interfacial characterization reveals that the unique diffusion-bonded interface at the micrometer scale, being very favorable for enhancing global thermal conductivity (TC), has been achieved by conventional VHP technique due to its large processing window and homogenous thermal field. Comparatively, micrometer-scale and, even macroscopic (radial and axial) thermal gradients can be inevitably generated during the SPS process in rapid heating-cooling mode. As a result, the mixed interfacial bonding states have always been introduced in the SPSed samples which reduce the effectiveness of TC enhancement. The formation mechanisms of nanoscale interfacial Al2O3 and Al4C3 at the diamond/Al interface are also discussed.< Réduire

Mots clés en anglais

Metal-matrix composites (MMCs)

Thermal properties

Electron microscopy

Powder processing

Métadonnées

Licence d’utilisation du document

Tailoring interfacial bonding states of highly thermal performance diamond/Al composites: Spark plasma sintering vs. vacuum hot pressing

Langue

Ce document a été publié dans

Résumé en anglais

Mots clés en anglais

DOI

Origine

Unités de recherche