FAN, Lisha; ZHOU, Yunshen; WANG, Mengmeng; SILVAIN, Jean-François; LU, Yongfeng

doi:10.1016/j.tsf.2017.06.058

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FAN, Lisha
Department of Electrical Engineering

ZHOU, Yunshen
Department of Electrical Engineering

WANG, Mengmeng
Department of Electrical Engineering

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Thin Solid Films. 2017, vol. 636, p. 499-505

Elsevier

Résumé en anglais

We demonstrate that femtosecond (fs) laser patterning of Cu can be exploited to realize seed-free deposition of large-area adhesive diamond films on Cu. Fs-laser-induced nanostructures promote diamond nucleation density and result in diamond film formation within a laser fluence window from 2.6 to 3.6 J cm− 2. Diamond films deposited on Cu surfaces prepared outside this window experience either complete film detachment or formation of low-quality ball-like diamond grains. Diamond/substrate interface roughness plays a critical role in controlling diamond quality and adhesion between substrates and diamond films. Large-area adhesive diamond films have been achieved on Cu substrate surfaces that were first modified with fs-laser irradiation and then scribed into grid patterns. The scribed channels function as expansion joints for stress relief. Strain-free diamond films have been achieved by optimizing the grid size. Using fs-laser processing for seed-free deposition of large-area diamond films on Cu is of great significance for diverse applications, such as thermal management and power electronic devices.< Réduire

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Diamond

Copper

Thin film

Femtosecond laser processing

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Seed-free deposition of large-area adhesive diamond films on copper surfaces processed and patterned by femtosecond lasers

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