Seed-free deposition of large-area adhesive diamond films on copper surfaces processed and patterned by femtosecond lasers
| hal.structure.identifier | Department of Electrical Engineering | |
| dc.contributor.author | FAN, Lisha | |
| hal.structure.identifier | Department of Electrical Engineering | |
| dc.contributor.author | ZHOU, Yunshen | |
| hal.structure.identifier | Department of Electrical Engineering | |
| dc.contributor.author | WANG, Mengmeng | |
| hal.structure.identifier | Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB] | |
| dc.contributor.author | SILVAIN, Jean-François | |
| hal.structure.identifier | Department of Electrical Engineering | |
| dc.contributor.author | LU, Yongfeng | |
| dc.date.issued | 2017 | |
| dc.identifier.issn | 0040-6090 | |
| dc.description.abstractEn | We demonstrate that femtosecond (fs) laser patterning of Cu can be exploited to realize seed-free deposition of large-area adhesive diamond films on Cu. Fs-laser-induced nanostructures promote diamond nucleation density and result in diamond film formation within a laser fluence window from 2.6 to 3.6 J cm− 2. Diamond films deposited on Cu surfaces prepared outside this window experience either complete film detachment or formation of low-quality ball-like diamond grains. Diamond/substrate interface roughness plays a critical role in controlling diamond quality and adhesion between substrates and diamond films. Large-area adhesive diamond films have been achieved on Cu substrate surfaces that were first modified with fs-laser irradiation and then scribed into grid patterns. The scribed channels function as expansion joints for stress relief. Strain-free diamond films have been achieved by optimizing the grid size. Using fs-laser processing for seed-free deposition of large-area diamond films on Cu is of great significance for diverse applications, such as thermal management and power electronic devices. | |
| dc.language.iso | en | |
| dc.publisher | Elsevier | |
| dc.subject.en | Diamond | |
| dc.subject.en | Copper | |
| dc.subject.en | Thin film | |
| dc.subject.en | Femtosecond laser processing | |
| dc.title.en | Seed-free deposition of large-area adhesive diamond films on copper surfaces processed and patterned by femtosecond lasers | |
| dc.type | Article de revue | |
| dc.identifier.doi | 10.1016/j.tsf.2017.06.058 | |
| dc.subject.hal | Chimie/Matériaux | |
| bordeaux.journal | Thin Solid Films | |
| bordeaux.page | 499-505 | |
| bordeaux.volume | 636 | |
| bordeaux.peerReviewed | oui | |
| hal.identifier | hal-01569398 | |
| hal.version | 1 | |
| hal.popular | non | |
| hal.audience | Internationale | |
| hal.origin.link | https://hal.archives-ouvertes.fr//hal-01569398v1 | |
| bordeaux.COinS | ctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Thin%20Solid%20Films&rft.date=2017&rft.volume=636&rft.spage=499-505&rft.epage=499-505&rft.eissn=0040-6090&rft.issn=0040-6090&rft.au=FAN,%20Lisha&ZHOU,%20Yunshen&WANG,%20Mengmeng&SILVAIN,%20Jean-Fran%C3%A7ois&LU,%20Yongfeng&rft.genre=article |
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