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hal.structure.identifierDepartment of Electrical Engineering
dc.contributor.authorFAN, Lisha
hal.structure.identifierDepartment of Electrical Engineering
dc.contributor.authorZHOU, Yunshen
hal.structure.identifierDepartment of Electrical Engineering
dc.contributor.authorWANG, Mengmeng
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorSILVAIN, Jean-François
hal.structure.identifierDepartment of Electrical Engineering
dc.contributor.authorLU, Yongfeng
dc.date.issued2017
dc.identifier.issn0040-6090
dc.description.abstractEnWe demonstrate that femtosecond (fs) laser patterning of Cu can be exploited to realize seed-free deposition of large-area adhesive diamond films on Cu. Fs-laser-induced nanostructures promote diamond nucleation density and result in diamond film formation within a laser fluence window from 2.6 to 3.6 J cm− 2. Diamond films deposited on Cu surfaces prepared outside this window experience either complete film detachment or formation of low-quality ball-like diamond grains. Diamond/substrate interface roughness plays a critical role in controlling diamond quality and adhesion between substrates and diamond films. Large-area adhesive diamond films have been achieved on Cu substrate surfaces that were first modified with fs-laser irradiation and then scribed into grid patterns. The scribed channels function as expansion joints for stress relief. Strain-free diamond films have been achieved by optimizing the grid size. Using fs-laser processing for seed-free deposition of large-area diamond films on Cu is of great significance for diverse applications, such as thermal management and power electronic devices.
dc.language.isoen
dc.publisherElsevier
dc.subject.enDiamond
dc.subject.enCopper
dc.subject.enThin film
dc.subject.enFemtosecond laser processing
dc.title.enSeed-free deposition of large-area adhesive diamond films on copper surfaces processed and patterned by femtosecond lasers
dc.typeArticle de revue
dc.identifier.doi10.1016/j.tsf.2017.06.058
dc.subject.halChimie/Matériaux
bordeaux.journalThin Solid Films
bordeaux.page499-505
bordeaux.volume636
bordeaux.peerReviewedoui
hal.identifierhal-01569398
hal.version1
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-01569398v1
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Thin%20Solid%20Films&rft.date=2017&rft.volume=636&rft.spage=499-505&rft.epage=499-505&rft.eissn=0040-6090&rft.issn=0040-6090&rft.au=FAN,%20Lisha&ZHOU,%20Yunshen&WANG,%20Mengmeng&SILVAIN,%20Jean-Fran%C3%A7ois&LU,%20Yongfeng&rft.genre=article


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