BRONCHY, Maxime; SOURIAU, Jean-Charles; HEINTZ, Jean-Marc; FEAUTRIER, Céline; HENRY, David; DUGUET, Etienne; MENDIZABAL, Laurent; SIMON, Gilles; TRÉGUER-DELAPIERRE, Mona

doi:10.1109/ESTC48849.2020.9229830

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BRONCHY, Maxime
Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information [CEA-LETI]
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]

SOURIAU, Jean-Charles
Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information [CEA-LETI]

HEINTZ, Jean-Marc
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]

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2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 2020-09-15, Tønsberg. 2020p. 1-5

IEEE

Résumé en anglais

The interest of silver nanostructures has surged in recent years as they are becoming promising materials in a growing number of applications. In particular, they have received intense attention for their use as lead-free die attach materials, photoactive devices engineering or more broadly electronic packaging. One of the challenges is the elaboration of conductive and printable patterns by Low-Temperature and Pressureless Sintering Techniques (LTPST) to achieve electric circuits on heat-sensitive substrates such as paper, plastic, polymeric substrates. Here, we present a facile method for synthesizing conductive patterns at low temperature based on the formation of self-assembled Ag nanocubes on Active Metal Brazing (AMB) substrates. The elaboration of 3-D arrays with nanogap of 2-3 nm between the cubic building units allows to get dense and compact packed nanoparticle solids which sinter at lower temperature than conventional commercial silver pastes. The impact of the capping agent and the size of the building units on the sintering properties were investigated and discussed.< Réduire

Mots clés en anglais

Silver

sintering

nanocubes

LTPST

self-assembly

supercrystals

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Low-temperature silver sintering by colloidal approach

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