FOUASSIER, Olivier; CHAZELAS, Jean; SILVAIN, Jean-François

doi:10.1016/S1359-835X(02)00154-9

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FOUASSIER, Olivier
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]

CHAZELAS, Jean
THALES Airborne Systems [Elancourt]

SILVAIN, Jean-François
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]

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Composites Part A: Applied Science and Manufacturing. 2002, vol. 33, n° 10, p. 1391-1395

Elsevier

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Copper coated NiTi particles have been incorporated into a lead free solder paste in order to improve mechanical performances of solder joints. In order to optimise the thickness of the copper coating, interfacial reactions between Sn-3.8Ag-0.7Cu (wt%) and copper substrate have been studied. Auger Electron Spectroscopy linescan profile across the copper substrate and the Sn-3.8Ag-0.7Cu matrix interface has shown that the reaction layer is composed of Cu3Sn and Cu6Sn5 intermetallics. The formation and growth of this layer has been discussed. Finally the diffusion constant and activation energy for the diffusion of copper in the liquid and solid Sn-3.8Ag-0.7Cu matrix have been determined.< Leer menos

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Lead-free solder

Nickel titanium (NiTi)

Shape memory alloy

Metal matrix composite

Electroless copper coating

Interfacial study

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