[Sans titre]
Langue
en
Article de revue
Ce document a été publié dans
Composites Part A: Applied Science and Manufacturing. 2002, vol. 33, n° 10, p. 1391-1395
Elsevier
Résumé en anglais
Copper coated NiTi particles have been incorporated into a lead free solder paste in order to improve mechanical performances of solder joints. In order to optimise the thickness of the copper coating, interfacial reactions ...Lire la suite >
Copper coated NiTi particles have been incorporated into a lead free solder paste in order to improve mechanical performances of solder joints. In order to optimise the thickness of the copper coating, interfacial reactions between Sn-3.8Ag-0.7Cu (wt%) and copper substrate have been studied. Auger Electron Spectroscopy linescan profile across the copper substrate and the Sn-3.8Ag-0.7Cu matrix interface has shown that the reaction layer is composed of Cu3Sn and Cu6Sn5 intermetallics. The formation and growth of this layer has been discussed. Finally the diffusion constant and activation energy for the diffusion of copper in the liquid and solid Sn-3.8Ag-0.7Cu matrix have been determined.< Réduire
Mots clés en anglais
Lead-free solder
Nickel titanium (NiTi)
Shape memory alloy
Metal matrix composite
Electroless copper coating
Interfacial study
Origine
Importé de halUnités de recherche