Dynamics of the corrosion for SAC305 solder alloy in salt environment
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2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022-04-25, St Julian. 2022p. 1-6
IEEE
Resumen en inglés
This study presents the corrosion dynamics of SAC305 solder alloy in two configurations (BGA solder balls components and solder material in globule) using a neutral salt spray test (NSS). SAC305 solder alloys were aged in ...Leer más >
This study presents the corrosion dynamics of SAC305 solder alloy in two configurations (BGA solder balls components and solder material in globule) using a neutral salt spray test (NSS). SAC305 solder alloys were aged in different exposure durations ranging from 24 to 96 hours in a salt spray chamber with one salinity of 5 % NaCl at five temperatures ranging from 25°C to 45°C. Corrosion morphology, chemical composition and distribution of the elements in the corroded area and the corrosion product phases produced respectively after OM, SEM, EDX and XRD were also analyzed. The visible corrosion criterion defined on the OM and SEM results showed that the corroded areas are visible after 72h at 25°C, 60h at 30°C, 48h at 35°C, 36h at 40°C and only 24 h, at 45°C in case of BGAs solder balls components. The corroded area becomes larger at 96 hours. This indicates that temperature accelerates the corrosion mechanism. Moreover, according to the EDX result, tin (Sn), oxygen (O), and chloride ion (Cl-) were detected in the corroded area on solder balls. An activation energy (Ea) of 0.81 eV has been calculated. XRD measurements confirmed that a complex oxide chloride hydroxide (Sn3O(OH)2Cl2) was formed as a corrosion product on SAC globules. Finally, the kinetics of the failure mechanism of corrosion was investigated to refine the dynamic models of the degradation and overlay it on excessive stresses by simulations in order to predict lead-free solder alloys' lifetime.< Leer menos
Palabras clave en inglés
Corrosion
Salt spray test
Solder ball
Sn-Ag-Cu alloy
Dynamics
Simulation
Centros de investigación