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Thermomechanical effects in metal lines on integrated circuits analysed with a differential polarimetric interferometer
(Microelectronics Reliability. vol. 38, n° 10, pp. 1591-1597, 1998-10)Article de revue -
Sondes laser et méthodologies pour l'analyse thermique à l'échelle micrométrique. Application à la microélectronique
(Revue Générale de Thermique. vol. 37, n° 1, pp. 49-59, 1998-01)Article de revue -
Development of instruments and very-high-resolution laser methodologies for characterization of electronic components
(Annales De Physique. vol. 23, pp. 65-72, 1998)Article de revue -
Thermoreflectance measurements of transient temperature upon integrated circuits: application to thermal conductivity identification
(Microelectronics Reliability. vol. 29, n° 4-5, pp. 181-190, 1998-04)Article de revue -
Thermal characterization of defects in an IC: Thermal testing
(1998)Ouvrage