Additive manufacturing of copper/diamond composites for thermal management applications
| hal.structure.identifier | University of Nebraska–Lincoln | |
| hal.structure.identifier | Department of Electrical and Computer Engineering | |
| hal.structure.identifier | Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB] | |
| dc.contributor.author | CONSTANTIN, Loïc | |
| hal.structure.identifier | University of Nebraska–Lincoln | |
| hal.structure.identifier | Department of Electrical and Computer Engineering | |
| dc.contributor.author | FAN, Lisha | |
| hal.structure.identifier | Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB] | |
| dc.contributor.author | PONTOREAU, Mael | |
| hal.structure.identifier | Department of Mechanical and Materials Engineering | |
| dc.contributor.author | WANG, Fei | |
| hal.structure.identifier | Department of Mechanical and Materials Engineering | |
| dc.contributor.author | CUI, Bai | |
| hal.structure.identifier | Institut de Mécanique et d'Ingénierie [I2M] | |
| dc.contributor.author | BATTAGLIA, Jean-Luc
IDREF: 084712562 | |
| hal.structure.identifier | Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB] | |
| dc.contributor.author | SILVAIN, Jean-François | |
| hal.structure.identifier | University of Nebraska–Lincoln | |
| hal.structure.identifier | Department of Electrical and Computer Engineering | |
| dc.contributor.author | LU, Yong Feng | |
| dc.date.accessioned | 2021-05-14T09:35:22Z | |
| dc.date.available | 2021-05-14T09:35:22Z | |
| dc.date.issued | 2020-04 | |
| dc.identifier.issn | 2213-8463 | |
| dc.identifier.uri | https://oskar-bordeaux.fr/handle/20.500.12278/76205 | |
| dc.description.abstractEn | Copper (Cu)/diamond (D) composites have excellent thermal properties but are hard to manufacture with conventional methods. Additive manufacturing (AM) can overcome this issue because of its high degree of freedom to fabricate complex designs. In this letter, we demonstrate the laser directed energy deposition of Cu/D composites. D particles were coated with graded TiO2-TiC interphase to enhance its wettability with molten Cu. A relatively dense Cu/25 vol% coated-D composite was printed (96%) at an energy density of 1200 J/mm3 (power = 900 W, scan = 12.7 mm/s) with high thermal conductivity (330 W/m.K), and no graphitization of the D. | |
| dc.language.iso | en | |
| dc.publisher | Elsevier | |
| dc.subject.en | Additive manufacturing | |
| dc.subject.en | composites | |
| dc.subject.en | copper | |
| dc.subject.en | diamond | |
| dc.subject.en | interphase | |
| dc.title.en | Additive manufacturing of copper/diamond composites for thermal management applications | |
| dc.type | Article de revue | |
| dc.identifier.doi | 10.1016/j.mfglet.2020.03.014 | |
| dc.subject.hal | Chimie/Matériaux | |
| bordeaux.journal | Manufacturing Letters | |
| bordeaux.page | 61-66 | |
| bordeaux.volume | 24 | |
| bordeaux.hal.laboratories | Institut de Mécanique et d’Ingénierie de Bordeaux (I2M) - UMR 5295 | * |
| bordeaux.institution | Université de Bordeaux | |
| bordeaux.institution | Bordeaux INP | |
| bordeaux.institution | CNRS | |
| bordeaux.institution | INRAE | |
| bordeaux.institution | Arts et Métiers | |
| bordeaux.peerReviewed | oui | |
| hal.identifier | hal-02565504 | |
| hal.version | 1 | |
| hal.origin.link | https://hal.archives-ouvertes.fr//hal-02565504v1 | |
| bordeaux.COinS | ctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Manufacturing%20Letters&rft.date=2020-04&rft.volume=24&rft.spage=61-66&rft.epage=61-66&rft.eissn=2213-8463&rft.issn=2213-8463&rft.au=CONSTANTIN,%20Lo%C3%AFc&FAN,%20Lisha&PONTOREAU,%20Mael&WANG,%20Fei&CUI,%20Bai&rft.genre=article |
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