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Un coupleur hybride accordable à ondes lentes CMOS FD-SOI 26-44 GHz 28 nm pour application 5G
Communication dans un congrès -
Study of an Avalanche Compensation Mirror for SiGe High Performance Power Amplifiers dedicated to 5G applications
Communication dans un congrès -
A 24.25-30.5GHz Fully Integrated SiGe Phase Shifter/VGA/Power Amplifier in 0.13μm BiCMOS Technology for 5G Beamforming Applications
Communication dans un congrèsLibre acceso -
Un amplificateur de puissance Doherty basé sur un coupleur hybride inductif résilient VSWR FD-SOI CMOS 3:1 24-31 GHz 28 nm
Communication dans un congrès -
Is virtual reality so user-friendly for non-designers in early design activities? Comparing skills needed to traditional sketching versus virtual reality sketching
(Design Science. vol. 9, n° 28, 2023-09-25)Article de revueLibre acceso -
Moisture Diffusion Inside the BEOL of an FC-PBGA Package
(IEEE Transactions on Components, Packaging and Manufacturing Technology. vol. 12, n° 11, pp. 1740-1747, 2022-11)Article de revueLibre acceso -
Sub 1 μm Pitch Achievement for Cu/SiO2 Hybrid Bonding
(24th Electronics Packaging Technology Conference, 24th Electronics Packaging Technology Conference Singapore | Dec 7-9, 2022, sg, Singapour, 2023-01-18)Communication dans un congrès avec actes -
Methodology of backside preparation applied on a MRAM to lead a logical investigation with a near-field probe
Communication dans un congrès -
Using X-ray imaging for the study of crack development in solder reliability testing
Communication dans un congrès -
Reliability of the hybrid bonding level using submicrometric bonding pads
Communication dans un congrès