Recherche
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Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements
(ECS Journal of Solid State Science and Technology. vol. 11, n° 2, pp. 024001, 2022-02-01)Article de revue -
New Method to Perform TDDB Tests for Hybrid Bonding Interconnects
(2022 IEEE International Reliability Physics Symposium (IRPS), International Reliability Physics Symposium (IRPS), us, Dallas, 2022-03)Communication dans un congrès avec actes -
Thermomechanical Characterizations of Copper at Nanoscale by Laue Microdiffraction
(Workshop Correlative Materials Characterization, Workshop Correlative Materials Characterization, de, Dresde, 2022-10)Autre communication scientifique (congrès sans actes - poster - séminaire...) -
Sub 1 μm Pitch Achievement for Cu/SiO2 Hybrid Bonding
(24th Electronics Packaging Technology Conference, 24th Electronics Packaging Technology Conference Singapore | Dec 7-9, 2022, sg, Singapour, 2023-01-18)Communication dans un congrès avec actes -
Thermomechanical Characterizations of Copper at Nanoscale by Laue Microdiffraction
(Satellite European School for Young Scientists Microscopy and Materials Characterization, Satellite European School for Young Scientists Microscopy and Materials Characterization, de, Dresde, 2022-10-12)Autre communication scientifique (congrès sans actes - poster - séminaire...)Libre accès -
Reliability of the hybrid bonding level using submicrometric bonding pads
Communication dans un congrès -
Investigation into Cu diffusion at the Cu/SiO2 hybrid bonding interface of 3D stacked integrated circuits
(Microelectronics Reliability. vol. 143, pp. 114934, 2023-04-01)Article de revue -
Recent Advances on Qualification and Reliability of Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D ICs
Communication dans un congrès