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Un amplificateur de puissance Doherty basé sur un coupleur hybride inductif résilient VSWR FD-SOI CMOS 3:1 24-31 GHz 28 nm
Communication dans un congrès -
A Low-Cost Bench for Training Students in Power Amplifier and Digital Predistortion
Communication dans un congrès -
A MCU-robust Interleaved Data/Detection SRAM for Space Environments
Communication dans un congrès -
Thermomechanical Characterizations of Copper at Nanoscale by Laue Microdiffraction
(Workshop Correlative Materials Characterization, Workshop Correlative Materials Characterization, de, Dresde, 2022-10)Autre communication scientifique (congrès sans actes - poster - séminaire...) -
Sub 1 μm Pitch Achievement for Cu/SiO2 Hybrid Bonding
(24th Electronics Packaging Technology Conference, 24th Electronics Packaging Technology Conference Singapore | Dec 7-9, 2022, sg, Singapour, 2023-01-18)Communication dans un congrès avec actes -
Methodology of backside preparation applied on a MRAM to lead a logical investigation with a near-field probe
Communication dans un congrès -
Using X-ray imaging for the study of crack development in solder reliability testing
Communication dans un congrès -
Reliability of the hybrid bonding level using submicrometric bonding pads
Communication dans un congrès -
Investigating the degradation mechanisms of moisture on the reliability of integrated low-k stack
Communication dans un congrès -
Investigation into Cu diffusion at the Cu/SiO2 hybrid bonding interface of 3D stacked integrated circuits
(Microelectronics Reliability. vol. 143, pp. 114934, 2023-04-01)Article de revue