Recherche
-
High-Resolution Fractional Digital Frequency Divider using a Binary-Rate Multiplier
(21st IEEE Interregional NEWCAS Conference (NEWCAS 2023), 21st IEEE Interregional NEWCAS Conference (NEWCAS 2023), gb, Edimbourg, 2023-06-26)Communication dans un congrès avec actes -
Un coupleur hybride accordable à ondes lentes CMOS FD-SOI 26-44 GHz 28 nm pour application 5G
Communication dans un congrès -
Un amplificateur de puissance Doherty basé sur un coupleur hybride inductif résilient VSWR FD-SOI CMOS 3:1 24-31 GHz 28 nm
Communication dans un congrès -
A Low-Cost Bench for Training Students in Power Amplifier and Digital Predistortion
Communication dans un congrès -
A MCU-robust Interleaved Data/Detection SRAM for Space Environments
Communication dans un congrès -
Thermomechanical Characterizations of Copper at Nanoscale by Laue Microdiffraction
(Workshop Correlative Materials Characterization, Workshop Correlative Materials Characterization, de, Dresde, 2022-10)Autre communication scientifique (congrès sans actes - poster - séminaire...) -
Moisture Diffusion Inside the BEOL of an FC-PBGA Package
(IEEE Transactions on Components, Packaging and Manufacturing Technology. vol. 12, n° 11, pp. 1740-1747, 2022-11)Article de revueLibre accès -
Sub 1 μm Pitch Achievement for Cu/SiO2 Hybrid Bonding
(24th Electronics Packaging Technology Conference, 24th Electronics Packaging Technology Conference Singapore | Dec 7-9, 2022, sg, Singapour, 2023-01-18)Communication dans un congrès avec actes -
Thermomechanical Characterizations of Copper at Nanoscale by Laue Microdiffraction
(Satellite European School for Young Scientists Microscopy and Materials Characterization, Satellite European School for Young Scientists Microscopy and Materials Characterization, de, Dresde, 2022-10-12)Autre communication scientifique (congrès sans actes - poster - séminaire...)Libre accès -
Methodology of backside preparation applied on a MRAM to lead a logical investigation with a near-field probe
Communication dans un congrès