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Towards the Integration of an Islet-Based Biosensor in Closed-Loop Therapies for Patients With Type 1 Diabetes
(Frontiers in Endocrinology. vol. 13, 2022-04-22)Article de revue -
In vitro differentiation of human cardiac fibroblasts into myofibroblasts: characterization using electrical impedance
(Biomedical Physics & Engineering Express. vol. 8, n° 5, pp. 055007, 2022-07-07)Article de revue -
Integrated-Transformer-Based Impedance Matching Method: Impedance Matching With Transformers
(IEEE Microwave Magazine. vol. 23, n° 9, pp. 40-56, 2022-08-02)Article de revue -
Analysis of families of divergences to compare Gaussian processes modeled by sums of complex exponentials disturbed by additive white noises
(Digital Signal Processing. vol. 123, pp. 103436, 2022-04)Article de revue -
QFN (Quad Flat No–lead) SAC Solder Joints under Thermal Cycling: Identification of Two Failure Mechanisms
(2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 72nd Electronic Components and Technology Conference (ECTC), us, San Diego, 2022-05-01)Communication dans un congrès avec actes -
Unconventional protocol for SAW sensor: multi-physic response enrichment in liquid medium
(IEEE Sensors Journal. vol. 22, n° 12, pp. 10p, 2021)Article de revue -
Building an Operable Graph Representation of a Java Program as a Basis for Automatic Software Maintainability Analysis
(ICPS Proceedings, EASE 2022 : The International Conference on Evaluation and Assessment in Software Engineering, se, Göteborg, 2022-06-13)Communication dans un congrès avec actes -
New Method to Perform TDDB Tests for Hybrid Bonding Interconnects
(2022 IEEE International Reliability Physics Symposium (IRPS), International Reliability Physics Symposium (IRPS), us, Dallas, 2022-03)Communication dans un congrès avec actes -
Evaluation of SAC solder joint thermomechanical fatigue in different types of components
(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)Communication dans un congrès avec actes -
Metal 3D printing for RF/microwave high-frequency parts
(CEAS Space Journal, 2022-05)Article de revue