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Thermal Modelling and Power Consumption Estimation of a Multi Floor Small Scale Building Using SPICE Simulator
(WSEAS Transactions on Environment and Development. vol. 18, pp. 315-321, 2022-02-09)Article de revueOpen access -
A New Approach in the Field of Hydrogen Gas Sensing Using MEMS Based 3C-SiC Microcantilevers
(13th European Conference on Silicon Carbide and Related Materials, ECSCRM 2020·2021, fr, Tours, 2022-05-31)Communication dans un congrès avec actesOpen access -
Chemical sensor based on a novel capacitive microwave flexible transducer with polymer nanocomposite-carbon nanotube sensitive film
(Microsystem Technologies. vol. 28, pp. 1365-1378, 2022-06)Article de revue -
Vertical Organic Electrochemical Transistors and Electronics for Low Amplitude Micro‐Organ Signals
(Advanced Science. vol. 9, n° 8, pp. 2105211, 2022-01)Article de revueOpen access -
In-situ characterization of thermomechanical behavior of copper nano-interconnect for 3D integration
(Microelectronic Engineering. vol. 261, pp. 111809, 2022-05)Article de revue -
Screen-Printed Microcantilevers Coated with Functionalized Mesocellular Foam Silica for Detection of Solvent Vapors
(IEEE Sensors Journal. pp. 1-1, 2022-01-01)Article de revue -
Dynamics of the corrosion for SAC305 solder alloy in salt environment
(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)Communication dans un congrès avec actes -
2D Model for moisture diffusion in integrated Low-k dielectrics
(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)Communication dans un congrès avec actes -
Extraction of small-signal equivalent circuit for de-embedding of 3D vertical nanowire transistor
(Solid-State Electronics. vol. 194, pp. 108359, 2022-08)Article de revue -
Frequency Identification of a Memory Polynomial Model for PA Modeling
(2022 IEEE International Instrumentation and Measurement Technology Conference (I2MTC), I2MTC 2022, ca, Ottawa, 2022-05-16)Communication dans un congrès avec actesOpen access