Recherche
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New Method to Perform TDDB Tests for Hybrid Bonding Interconnects
(2022 IEEE International Reliability Physics Symposium (IRPS), International Reliability Physics Symposium (IRPS), us, Dallas, 2022-03)Communication dans un congrès avec actes -
Evaluation of SAC solder joint thermomechanical fatigue in different types of components
(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)Communication dans un congrès avec actes -
Metal 3D printing for RF/microwave high-frequency parts
(CEAS Space Journal, 2022-05)Article de revue -
Self-Deformable Flexible MEMS Tweezer Composed of Poly(Vinylidene Fluoride)/Ionic Liquid Gel for Electrical Measurements and Soft Gripping
(Journal of Microelectromechanical Systems. vol. 31, n° 5, pp. 802-812, 2022-07-29)Article de revue -
A 5G 65-nm PD-SOI CMOS 23.2-to-28.8 GHz Low-Jitter Quadrature-Coupled Injection-Locked Digitally-Controlled Oscillator
(2022 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 2022 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), us, Denver, 2022-08-26)Communication dans un congrès avec actes -
A 24-31GHz 28nm FD-SOI CMOS Balanced Power Amplifier Robust to 3:1 VSWR for 5G Application
(2022 52nd European Microwave Conference (EuMC), 2022 52nd European Microwave Conference (EuMC), it, Milan, 2022-10-31)Communication dans un congrès avec actes -
Spectral measurements with hybrid LMR and SAW platform for dual parameter sensing
(Analyst. vol. 147, n° 23, pp. 5477-5485, 2022-11-21)Article de revue -
A PAE-Controlled Wideband Power Amplifier for Sub-6GHz 5G Applications in 28nm FDSOI Technology
(2022 29th IEEE International Conference on Electronics, Circuits and Systems (ICECS), 2022 29th IEEE International Conference on Electronics, Circuits and Systems (ICECS), gb, Glasgow, 2022-12-12)Communication dans un congrès avec actes -
S-Parameter Measurement and EM Simulation of Electronic Devices towards THz frequency range
(2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS 2022), 2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS 2022), us, Cleveland, OH, 2022-09-26)Communication dans un congrès avec actesLibre accès -
Development of a Versatile Strategy for Inkjet-Printed Molecularly Imprinted Polymer Microarrays
(Chemosensors. vol. 10, n° 10, pp. 396, 2022-09-28)Article de revueLibre accès