Browsing IMS : Laboratoire de l'Intégration du Matériau au Système - UMR 5218 by Author "LAMBERT, Benoit"
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Epoxy Mold Compound Characterization for Modeling Packaging Reliability
TOMAS, Ariane; LAMBERT, Benoit; FREMONT, Helene ...(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)Communication dans un congrès avec actes