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dc.rights.licenseopenen_US
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
hal.structure.identifierUnited Monolithic Semiconductors [UMS]
dc.contributor.authorTOMAS, Ariane
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorFREMONT, Helene
IDREF: 127007571
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorMALBERT, Nathalie
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorLABAT, Nathalie
IDREF: 094637385
hal.structure.identifierUnited Monolithic Semiconductors [UMS]
dc.contributor.authorLAMBERT, Benoit
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorPLANO, Bernard
dc.date.accessioned2025-03-04T13:30:34Z
dc.date.available2025-03-04T13:30:34Z
dc.date.issued2024
dc.date.conference2024-04-07
dc.identifier.urihttps://oskar-bordeaux.fr/handle/20.500.12278/205347
dc.description.abstractEnThis paper investigates the influence of the position of the QFN packages during manufacturing on their mechanical behaviour. The samples under test are representative of the final QFN products as they are extracted from uncut moulded leadframes. They are identified depending on their position towards the point of moulding injection. This study focuses on the granulometric and mechanical analysis of the Epoxy Mould Compounds (EMC) used for this packaging technology. The results show different filler distribution in the EMC, as well as different CTE and flexural modulus values of the EMC depending on the samples position. Moreover, this paper also proves the influence of that dispersal in the moulded leadframes on the overall thermomechanical behaviour of the QFNs depending on their position during manufacturing.
dc.language.isoENen_US
dc.publisherIEEEen_US
dc.subject.enSilicon compounds
dc.subject.enAdaptation models
dc.subject.enThermomechanical processes
dc.subject.enLead
dc.subject.enBending
dc.subject.enElectromagnetic compatibility
dc.subject.enManufacturing
dc.titleInvestigation of different thermomechanical behaviours in one batch of QFN packages
dc.typeCommunication dans un congrèsen_US
dc.identifier.doi10.1109/eurosime60745.2024.10491484en_US
dc.subject.halSciences de l'ingénieur [physics]en_US
bordeaux.page1-6en_US
bordeaux.hal.laboratoriesIMS : Laboratoire de l'Intégration du Matériau au Système - UMR 5218en_US
bordeaux.institutionUniversité de Bordeauxen_US
bordeaux.institutionBordeaux INPen_US
bordeaux.institutionCNRSen_US
bordeaux.conference.title2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)en_US
bordeaux.countryiten_US
bordeaux.title.proceeding2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2024)en_US
bordeaux.teamRELIABILITY - RIADen_US
bordeaux.conference.cityCataniaen_US
bordeaux.import.sourcecrossref
hal.identifierhal-04976119
hal.version1
hal.date.transferred2025-03-04T13:30:36Z
hal.proceedingsouien_US
hal.conference.end2024-04-20
hal.popularnonen_US
hal.audienceInternationaleen_US
hal.exporttrue
workflow.import.sourcecrossref
dc.rights.ccPas de Licence CCen_US
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.title=Investigation%20of%20different%20thermomechanical%20behaviours%20in%20one%20batch%20of%20QFN%20packages&rft.atitle=Investigation%20of%20different%20thermomechanical%20behaviours%20in%20one%20batch%20of%20QFN%20packages&rft.date=2024&rft.spage=1-6&rft.epage=1-6&rft.au=TOMAS,%20Ariane&FREMONT,%20Helene&MALBERT,%20Nathalie&LABAT,%20Nathalie&LAMBERT,%20Benoit&rft.genre=unknown


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