Investigation of different thermomechanical behaviours in one batch of QFN packages
dc.rights.license | open | en_US |
hal.structure.identifier | Laboratoire de l'intégration, du matériau au système [IMS] | |
hal.structure.identifier | United Monolithic Semiconductors [UMS] | |
dc.contributor.author | TOMAS, Ariane | |
hal.structure.identifier | Laboratoire de l'intégration, du matériau au système [IMS] | |
dc.contributor.author | FREMONT, Helene
IDREF: 127007571 | |
hal.structure.identifier | Laboratoire de l'intégration, du matériau au système [IMS] | |
dc.contributor.author | MALBERT, Nathalie | |
hal.structure.identifier | Laboratoire de l'intégration, du matériau au système [IMS] | |
dc.contributor.author | LABAT, Nathalie
IDREF: 094637385 | |
hal.structure.identifier | United Monolithic Semiconductors [UMS] | |
dc.contributor.author | LAMBERT, Benoit | |
hal.structure.identifier | Laboratoire de l'intégration, du matériau au système [IMS] | |
dc.contributor.author | PLANO, Bernard | |
dc.date.accessioned | 2025-03-04T13:30:34Z | |
dc.date.available | 2025-03-04T13:30:34Z | |
dc.date.issued | 2024 | |
dc.date.conference | 2024-04-07 | |
dc.identifier.uri | https://oskar-bordeaux.fr/handle/20.500.12278/205347 | |
dc.description.abstractEn | This paper investigates the influence of the position of the QFN packages during manufacturing on their mechanical behaviour. The samples under test are representative of the final QFN products as they are extracted from uncut moulded leadframes. They are identified depending on their position towards the point of moulding injection. This study focuses on the granulometric and mechanical analysis of the Epoxy Mould Compounds (EMC) used for this packaging technology. The results show different filler distribution in the EMC, as well as different CTE and flexural modulus values of the EMC depending on the samples position. Moreover, this paper also proves the influence of that dispersal in the moulded leadframes on the overall thermomechanical behaviour of the QFNs depending on their position during manufacturing. | |
dc.language.iso | EN | en_US |
dc.publisher | IEEE | en_US |
dc.subject.en | Silicon compounds | |
dc.subject.en | Adaptation models | |
dc.subject.en | Thermomechanical processes | |
dc.subject.en | Lead | |
dc.subject.en | Bending | |
dc.subject.en | Electromagnetic compatibility | |
dc.subject.en | Manufacturing | |
dc.title | Investigation of different thermomechanical behaviours in one batch of QFN packages | |
dc.type | Communication dans un congrès | en_US |
dc.identifier.doi | 10.1109/eurosime60745.2024.10491484 | en_US |
dc.subject.hal | Sciences de l'ingénieur [physics] | en_US |
bordeaux.page | 1-6 | en_US |
bordeaux.hal.laboratories | IMS : Laboratoire de l'Intégration du Matériau au Système - UMR 5218 | en_US |
bordeaux.institution | Université de Bordeaux | en_US |
bordeaux.institution | Bordeaux INP | en_US |
bordeaux.institution | CNRS | en_US |
bordeaux.conference.title | 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) | en_US |
bordeaux.country | it | en_US |
bordeaux.title.proceeding | 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2024) | en_US |
bordeaux.team | RELIABILITY - RIAD | en_US |
bordeaux.conference.city | Catania | en_US |
bordeaux.import.source | crossref | |
hal.identifier | hal-04976119 | |
hal.version | 1 | |
hal.date.transferred | 2025-03-04T13:30:36Z | |
hal.proceedings | oui | en_US |
hal.conference.end | 2024-04-20 | |
hal.popular | non | en_US |
hal.audience | Internationale | en_US |
hal.export | true | |
workflow.import.source | crossref | |
dc.rights.cc | Pas de Licence CC | en_US |
bordeaux.COinS | ctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.title=Investigation%20of%20different%20thermomechanical%20behaviours%20in%20one%20batch%20of%20QFN%20packages&rft.atitle=Investigation%20of%20different%20thermomechanical%20behaviours%20in%20one%20batch%20of%20QFN%20packages&rft.date=2024&rft.spage=1-6&rft.epage=1-6&rft.au=TOMAS,%20Ariane&FREMONT,%20Helene&MALBERT,%20Nathalie&LABAT,%20Nathalie&LAMBERT,%20Benoit&rft.genre=unknown |
Files in this item
Files | Size | Format | View |
---|---|---|---|
There are no files associated with this item. |