Investigation of different thermomechanical behaviours in one batch of QFN packages
TOMAS, Ariane
Laboratoire de l'intégration, du matériau au système [IMS]
United Monolithic Semiconductors [UMS]
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Laboratoire de l'intégration, du matériau au système [IMS]
United Monolithic Semiconductors [UMS]
TOMAS, Ariane
Laboratoire de l'intégration, du matériau au système [IMS]
United Monolithic Semiconductors [UMS]
< Reduce
Laboratoire de l'intégration, du matériau au système [IMS]
United Monolithic Semiconductors [UMS]
Language
EN
Communication dans un congrès
This item was published in
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2024), 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024-04-07, Catania. 2024p. 1-6
IEEE
English Abstract
This paper investigates the influence of the position of the QFN packages during manufacturing on their mechanical behaviour. The samples under test are representative of the final QFN products as they are extracted from ...Read more >
This paper investigates the influence of the position of the QFN packages during manufacturing on their mechanical behaviour. The samples under test are representative of the final QFN products as they are extracted from uncut moulded leadframes. They are identified depending on their position towards the point of moulding injection. This study focuses on the granulometric and mechanical analysis of the Epoxy Mould Compounds (EMC) used for this packaging technology. The results show different filler distribution in the EMC, as well as different CTE and flexural modulus values of the EMC depending on the samples position. Moreover, this paper also proves the influence of that dispersal in the moulded leadframes on the overall thermomechanical behaviour of the QFNs depending on their position during manufacturing.Read less <
English Keywords
Silicon compounds
Adaptation models
Thermomechanical processes
Lead
Bending
Electromagnetic compatibility
Manufacturing