Investigation of different thermomechanical behaviours in one batch of QFN packages
Idioma
EN
Communication dans un congrès
Este ítem está publicado en
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2024), 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024-04-07, Catania. 2024p. 1-6
IEEE
Resumen en inglés
This paper investigates the influence of the position of the QFN packages during manufacturing on their mechanical behaviour. The samples under test are representative of the final QFN products as they are extracted from ...Leer más >
Palabras clave en inglés
Silicon compounds
Adaptation models
Thermomechanical processes
Lead
Bending
Electromagnetic compatibility
Manufacturing