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dc.rights.licenseopenen_US
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorCOQUILLAS, Benjamin
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorKERHERVE, Eric
dc.contributor.authorAMIAUD, Anne-Charlotte
dc.contributor.authorREDOIS, Samuel
dc.contributor.authorROUSSEL, Laurent
dc.contributor.authorLOUIS, Bruno
dc.contributor.authorMERLET, Thomas
dc.contributor.authorPETIT, Vincent
dc.date.accessioned2024-03-19T10:31:05Z
dc.date.available2024-03-19T10:31:05Z
dc.date.issued2023-01-01
dc.identifier.issn1558-3791en_US
dc.identifier.urioai:crossref.org:10.1109/tcsi.2023.3274496
dc.identifier.urihttps://oskar-bordeaux.fr/handle/20.500.12278/188858
dc.description.abstractThis paper presents a highly compact Ku band 130nm SiGe power amplifier (PA) in a double balanced architecture. A highly compact low-loss 4 to 1 combiner is associated with a cascode topology to provide a power combination up to 1W and a high resilience to the standing wave ratio (SWR) from 2:1 to 4:1. A high thermal stability up to 120°C is ensured by an advanced configuration of transistors. A choices innovative set on the cascode stage design and layout improves the control of the impact ionization and selfheating. A driver stage allows the circuit to achieve over 20 dB of linear gain. At 30°C, 18 GHz and a supply voltage ( VSUPPLY ) of 4.2V, this power amplifier achieves a measured saturated power ( Psat ) of 30 dBm for an output power at the 1dB compression point (OCP 1dB ) of 28.8 dBm, a maximum power added efficiency (PAE) of 23.5% and a linear gain of 21.4 dB. The gain difference across 2:1 SWR phase variations is only 0.8 dB. The active area of the die chip is only 1.13 mm 2
dc.language.isoENen_US
dc.sourcecrossref
dc.subjectPower amplifiers
dc.subjectTransistors
dc.subjectImpact ionization
dc.subjectGain
dc.subjectSilicon germanium
dc.subjectPower measurement
dc.subjectPower generation
dc.subjectBalanced architecture
dc.subjecthigh Output power
dc.subjectKu band
dc.subjectK band
dc.subjectPower amplifier
dc.subjectSiGe
dc.subjectSWR-resilience
dc.subjectThermal stability
dc.subjectImpact ionization
dc.subjectSelfheating
dc.subjectAvalanche
dc.titleKu Band SiGe Power Amplifier With High Output Power and SWR Robustness Up to 120 °C
dc.typeArticle de revueen_US
dc.identifier.doi10.1109/tcsi.2023.3274496en_US
dc.subject.halSciences de l'ingénieur [physics]en_US
bordeaux.journalIEEE Transactions on Circuits and Systems I: Regular Papersen_US
bordeaux.page2744 - 2751en_US
bordeaux.volume70en_US
bordeaux.issue7en_US
bordeaux.institutionUniversité de Bordeauxen_US
bordeaux.institutionBordeaux INPen_US
bordeaux.institutionCNRSen_US
bordeaux.teamCIRCUIT DESIGN-CSHen_US
bordeaux.peerReviewedouien_US
bordeaux.inpressnonen_US
bordeaux.import.sourcedissemin
hal.popularnonen_US
hal.audienceInternationaleen_US
hal.exportfalse
workflow.import.sourcedissemin
dc.rights.ccPas de Licence CCen_US
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.title=Ku%20Band%20SiGe%20Power%20Amplifier%20With%20High%20Output%20Power%20and%20SWR%20Robustness%20Up%20to%20120%20%C2%B0C&rft.atitle=Ku%20Band%20SiGe%20Power%20Amplifier%20With%20High%20Output%20Power%20and%20SWR%20Robustness%20Up%20to%20120%20%C2%B0C&rft.jtitle=IEEE%20Transactions%20on%20Circuits%20and%20Systems%20I:%20Regular%20Papers&rft.date=2023-01-01&rft.volume=70&rft.issue=7&rft.spage=2744%20-%202751&rft.epage=2744%20-%202751&rft.eissn=1558-3791&rft.issn=1558-3791&rft.au=COQUILLAS,%20Benjamin&KERHERVE,%20Eric&AMIAUD,%20Anne-Charlotte&REDOIS,%20Samuel&ROUSSEL,%20Laurent&rft.genre=article


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