Chemical and morphological study of the sensitisatioin, activation and Cu electroless plating Al2O3 polycrystalline substrate
Langue
en
Article de revue
Ce document a été publié dans
Surface Science : A Journal Devoted to the Physics and Chemistry of Interfaces. 2004, vol. 557, n° 1-3, p. 129-143
Elsevier
Résumé en anglais
A study of the different stages of the electroless deposition of copper on polycrystalline alumina activated by a two-step method (sensitisation + activation) has been performed from both a chemical and a morphological ...Lire la suite >
Mots clés en anglais
Atomic force microscopy
Auger electron spectroscopy
X-ray photoelectron spectroscopy
Chemisorption
Copper
Palladium
Tin
Aluminum oxide