XPS investigations of Sn, Sn-Pd and Sn-Pd/Cu clusters produced by electroless deposition onto NiTi micronic particles formed by atomization
Langue
en
Article de revue
Ce document a été publié dans
Surface and Interface Analysis. 2004, vol. 36, n° 8, p. 769-772
Wiley-Blackwell
Résumé en anglais
XPS analysis of electroless deposition of successive Sn-Pd and Cu films on a NiTi surface has been performed in order to explain the nucleation and growth. Chemical interaction of Sn with the NiTi surface is shown to be ...Lire la suite >
XPS analysis of electroless deposition of successive Sn-Pd and Cu films on a NiTi surface has been performed in order to explain the nucleation and growth. Chemical interaction of Sn with the NiTi surface is shown to be associated with the growth of Sn oxide and hydroxide that can be formed after the reaction of Sn atoms with TiO2 oxide...< Réduire
Mots clés en anglais
Electroless deposition
Nickel titanium
Copper
Tin
Palladium
Oxygen
Cluster
XPS
Origine
Importé de halUnités de recherche