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hal.structure.identifierUniversity of Nebraska–Lincoln
hal.structure.identifierDepartment of Electrical and Computer Engineering
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorCONSTANTIN, Loïc
hal.structure.identifierUniversity of Nebraska–Lincoln
hal.structure.identifierDepartment of Electrical and Computer Engineering
dc.contributor.authorFAN, Lisha
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorPONTOREAU, Mael
hal.structure.identifierDepartment of Mechanical and Materials Engineering
dc.contributor.authorWANG, Fei
hal.structure.identifierDepartment of Mechanical and Materials Engineering
dc.contributor.authorCUI, Bai
hal.structure.identifierInstitut de Mécanique et d'Ingénierie [I2M]
dc.contributor.authorBATTAGLIA, Jean-Luc
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorSILVAIN, Jean-François
hal.structure.identifierUniversity of Nebraska–Lincoln
hal.structure.identifierDepartment of Electrical and Computer Engineering
dc.contributor.authorLU, Yong Feng
dc.date.issued2020-04
dc.identifier.issn2213-8463
dc.description.abstractEnCopper (Cu)/diamond (D) composites have excellent thermal properties but are hard to manufacture with conventional methods. Additive manufacturing (AM) can overcome this issue because of its high degree of freedom to fabricate complex designs. In this letter, we demonstrate the laser directed energy deposition of Cu/D composites. D particles were coated with graded TiO2-TiC interphase to enhance its wettability with molten Cu. A relatively dense Cu/25 vol% coated-D composite was printed (96%) at an energy density of 1200 J/mm3 (power = 900 W, scan = 12.7 mm/s) with high thermal conductivity (330 W/m.K), and no graphitization of the D.
dc.language.isoen
dc.publisherElsevier
dc.subject.enAdditive manufacturing
dc.subject.encomposites
dc.subject.encopper
dc.subject.endiamond
dc.subject.eninterphase
dc.title.enAdditive manufacturing of copper/diamond composites for thermal management applications
dc.typeArticle de revue
dc.identifier.doi10.1016/j.mfglet.2020.03.014
dc.subject.halChimie/Matériaux
bordeaux.journalManufacturing Letters
bordeaux.page61-66
bordeaux.volume24
bordeaux.peerReviewedoui
hal.identifierhal-02565504
hal.version1
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-02565504v1
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