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Laser sintering of cold-pressed Cu powder without binder use

hal.structure.identifierDepartment of Electrical and Computer Engineering
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorCONSTANTIN, Loic
hal.structure.identifierDepartment of Electrical and Computer Engineering
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorFAN, Lisha
hal.structure.identifierDirection générale de l'armement [France] [DGA]
dc.contributor.authorMORTAIGNE, Bruno
hal.structure.identifierDepartment of Electrical and Computer Engineering
dc.contributor.authorKERAMATNEJAD, Kamran
hal.structure.identifierDepartment of Electrical and Computer Engineering
dc.contributor.authorZOU, Qiming
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
hal.structure.identifierDepartment of Electrical and Computer Engineering
dc.contributor.authorAZINA, Clio
hal.structure.identifierDepartment of Electrical and Computer Engineering
dc.contributor.authorLU, Yong
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
hal.structure.identifierDepartment of Electrical and Computer Engineering
dc.contributor.authorSILVAIN, Jean-François
dc.date.issued2018-11
dc.identifier.issn2589-1529
dc.description.abstractEnIn this work, laser sintering (LS) of cold-pressed copper (Cu) powder without using a binder was demonstrated. To promote the densification of the final part, the Cu powder was cold pressed beforehand, thereby forming a densely packed powder bed for the LS. The densification and microstructural evolution study show that the cold-pressed powder led to an increase of up to 11% in the relative density and a decrease of 10 times in the surface roughness. The influence of the scan speed on the densification and sintering quality was studied. A relatively slow scan speed, 25 µm/s, allowed sufficient atomic diffusion during the LS process and ultimately produced dense Cu parts without cracks and open pores. The introduction of the cold-pressing step into the LS process is critical for achieving high-density powder metallurgy parts without using binders.
dc.language.isoen
dc.publisherElsevier
dc.subject.enDensification
dc.subject.enLaser sintering (LS)
dc.subject.enCopper powder
dc.subject.enDensification
dc.subject.enDensification
dc.title.enLaser sintering of cold-pressed Cu powder without binder use
dc.typeArticle de revue
dc.identifier.doi10.1016/j.mtla.2018.08.021
dc.subject.halChimie/Matériaux
bordeaux.journalMaterialia
bordeaux.page178-181
bordeaux.volume3
bordeaux.peerReviewedoui
hal.identifierhal-01136406
hal.version1
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-01136406v1
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Materialia&rft.date=2018-11&rft.volume=3&rft.spage=178-181&rft.epage=178-181&rft.eissn=2589-1529&rft.issn=2589-1529&rft.au=CONSTANTIN,%20Loic&FAN,%20Lisha&MORTAIGNE,%20Bruno&KERAMATNEJAD,%20Kamran&ZOU,%20Qiming&rft.genre=article


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