CONSTANTIN, Loic; FAN, Lisha; MORTAIGNE, Bruno; KERAMATNEJAD, Kamran; ZOU, Qiming; AZINA, Clio; LU, Yong; SILVAIN, Jean-François

doi:10.1016/j.mtla.2018.08.021

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CONSTANTIN, Loic
Department of Electrical and Computer Engineering
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]

FAN, Lisha
Department of Electrical and Computer Engineering
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]

MORTAIGNE, Bruno
Direction générale de l'armement [Bagneux] [DGA]

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Ce document a été publié dans

Materialia. 2018-11, vol. 3, p. 178-181

Elsevier

Résumé en anglais

In this work, laser sintering (LS) of cold-pressed copper (Cu) powder without using a binder was demonstrated. To promote the densification of the final part, the Cu powder was cold pressed beforehand, thereby forming a densely packed powder bed for the LS. The densification and microstructural evolution study show that the cold-pressed powder led to an increase of up to 11% in the relative density and a decrease of 10 times in the surface roughness. The influence of the scan speed on the densification and sintering quality was studied. A relatively slow scan speed, 25 µm/s, allowed sufficient atomic diffusion during the LS process and ultimately produced dense Cu parts without cracks and open pores. The introduction of the cold-pressing step into the LS process is critical for achieving high-density powder metallurgy parts without using binders.< Réduire

Mots clés en anglais

Densification

Laser sintering (LS)

Copper powder

Densification

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Laser sintering of cold-pressed Cu powder without binder use

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Résumé en anglais

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