Thermal properties of TiNiSn and VFeSb half-Heusler thermoelectrics from synchrotron x-ray powder diffraction
FERLUCCIO, Daniella
Institute of Chemical Sciences and Centre for Advanced Energy Storage and Recovery
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Institute of Chemical Sciences and Centre for Advanced Energy Storage and Recovery
FERLUCCIO, Daniella
Institute of Chemical Sciences and Centre for Advanced Energy Storage and Recovery
< Réduire
Institute of Chemical Sciences and Centre for Advanced Energy Storage and Recovery
Langue
en
Article de revue
Ce document a été publié dans
Journal of Physics: Energy. 2021-04-27, vol. 3, n° 3, p. 035001 (12 p.)
Résumé en anglais
Half-Heusler (HH) alloys are an important class of thermoelectric materials that combine promising performance with good engineering properties. This manuscript reports a variable temperature synchrotron x-ray diffraction ...Lire la suite >
Half-Heusler (HH) alloys are an important class of thermoelectric materials that combine promising performance with good engineering properties. This manuscript reports a variable temperature synchrotron x-ray diffraction study of several TiNiSn- and VFeSb-based HH alloys. A Debye model was found to capture the main trends in thermal expansion and atomic displacement parameters. The linear thermal expansion coefficient α(T) of the TiNiSn-based samples was found to be independent of alloying or presence of Cu interstitials with αav = 10.1 × 10−6 K−1 between 400 and 848 K. The α(T) of VFeSb and TiNiSn are well-matched, but NbFeSb has a reduced αav = 8.9 × 10−6 K−1, caused by a stiffer lattice structure. This is confirmed by analysis of the Debye temperatures, which indicate significantly larger bond force constants for all atomic sites in NbFeSb. This work also reveals substantial amounts of Fe interstitials in VFeSb, whilst these are absent for NbFeSb. The Fe interstitials are linked to low thermal conductivities, but also reduce the bandgap and lower the onset of thermal bipolar transport.< Réduire
Mots clés en anglais
half-Heusler
thermoelectric
thermal expansion
thermal conductivity
TiNiSn
VFeSb
Origine
Importé de halUnités de recherche