Porous 3D Cu structures with adaptive heat dissipation properties
SILVAIN, Jean-François
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
Department of Electrical and Computer Engineering
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Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
Department of Electrical and Computer Engineering
SILVAIN, Jean-François
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
Department of Electrical and Computer Engineering
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
Department of Electrical and Computer Engineering
CONSTANTIN, Loic
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
Department of Electrical and Computer Engineering
< Réduire
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
Department of Electrical and Computer Engineering
Langue
en
Article de revue
Ce document a été publié dans
MRS Communications. 2022, vol. 12, p. 753-758
Cambridge University Press
Résumé en anglais
This study focuses on the formulation of copper paste with optimal properties to micro-extrude porous Cu heat sinks, using extrusion additive manufacturing. The influence of the debinding and sintering conditions on the ...Lire la suite >
This study focuses on the formulation of copper paste with optimal properties to micro-extrude porous Cu heat sinks, using extrusion additive manufacturing. The influence of the debinding and sintering conditions on the porosity level and the heat dissipation behavior has been investigated. Open air debinding leads to a density increases from 200 up to 400°C, then decreases from 400 down to 600°C. This behavior is a result from a competition between densification and the oxidation. Heat dissipation of the copper heat sink increases with respect to the porosity ratio of the sintered part.< Réduire
Mots clés en anglais
3D printing
Cu
debinding
sintering
Additive manufacturing
thermal conductivity
Origine
Importé de halUnités de recherche