MAHO, Anthony; DENAYER, Jessica; DELHALLE, Joseph; MEKHALIF, Zineb

doi:10.1016/j.electacta.2011.02.020

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MAHO, Anthony
Fondation Universitaire Notre Dame de la Paix [FUNDP]
Laboratory of Chemistry and Electrochemistry of Surfaces

DENAYER, Jessica
Fondation Universitaire Notre Dame de la Paix [FUNDP]
Laboratory of Chemistry and Electrochemistry of Surfaces

DELHALLE, Joseph
Laboratory of Chemistry and Electrochemistry of Surfaces

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Electrochimica Acta. 2011-04, vol. 56, n° 11, p. 3954-3962

Elsevier

Résumé en anglais

Molecular assemblies of organothiol molecules on polycrystalline copper surfaces are a well known process to confer them specific organizational and protective properties. In this paper, an original and promising approach is considered through an electro-assisted adsorption process via a cathodic polarization of the copper substrate. Spectroscopic characterizations (PM-IRRAS, XPS) and electrochemical studies (CV, LSV, cathodic desorption, SECM) highlight and confirm the benefits brought by this methodology in terms of resulting SAMs features and considerable savings of preparation time. In addition to normal alkylthiols with a monopod anchoring group, alkyldithiocarboxylic acid and alkyldithiol monolayers – both bipodal – are characterized with the prospect of forming either easier to remove or more adherent films, respectively.< Réduire

Mots clés en anglais

Electro-assisted assembly

Alkanethiol 2-Monoalkylpropane-1

3-dithiol

Dithiocarboxylic acid

Copper

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Electro-assisted assembly of aliphatic thiol, dithiol and dithiocarboxylic acid monolayers on copper

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