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TRL-calibration Standards with Emphasis on Crosstalk Reduction
dc.rights.license | open | en_US |
hal.structure.identifier | Laboratoire de l'intégration, du matériau au système [IMS] | |
dc.contributor.author | CABBIA, Marco | |
hal.structure.identifier | Laboratoire de l'intégration, du matériau au système [IMS] | |
dc.contributor.author | FREGONESE, Sebastien | |
dc.contributor.author | YADAV, Chandan | |
hal.structure.identifier | Laboratoire de l'intégration, du matériau au système [IMS] | |
dc.contributor.author | ZIMMER, Thomas
IDREF: 076632598 | |
dc.date.accessioned | 2022-08-29T12:36:33Z | |
dc.date.available | 2022-08-29T12:36:33Z | |
dc.date.issued | 2022-05-18 | |
dc.date.conference | 2022-05-18 | |
dc.identifier.uri | oai:crossref.org:10.1109/gsmm53818.2022.9792326 | |
dc.identifier.uri | https://oskar-bordeaux.fr/handle/20.500.12278/140613 | |
dc.description.abstractEn | We present an innovative “shifted RF Pad” TRL on–wafer calibration kit to minimize the impact of crosstalk. The impact of the crosstalk in on-wafer measurement up to 330 GHz is observable by comparing results of DUTs obtained using the shifted and conventional RF pad calibration kit during calibration. Use of shifted RF pad structures shows improvement in measured DUT characteristics owing to reduced crosstalk. In addition, simulation results obtained using EM simulator, TCAD and SPICE models are employed to analyze the on-wafer measurement of DUTs. | |
dc.language.iso | EN | en_US |
dc.publisher | IEEE | en_US |
dc.source | crossref | |
dc.subject.en | S-paramater measurement | |
dc.subject.en | Semiconductor Devices | |
dc.subject.en | HBT | |
dc.subject.en | Sub-THz frequency | |
dc.subject.en | THz frequency | |
dc.subject.en | on-wafer TRL calibration | |
dc.subject.en | calibration kit structures design | |
dc.title.en | TRL-calibration Standards with Emphasis on Crosstalk Reduction | |
dc.type | Communication dans un congrès avec actes | en_US |
dc.identifier.doi | 10.1109/gsmm53818.2022.9792326 | en_US |
dc.subject.hal | Sciences de l'ingénieur [physics]/Micro et nanotechnologies/Microélectronique | en_US |
bordeaux.hal.laboratories | Laboratoire d’Intégration du Matériau au Système (IMS) - UMR 5218 | en_US |
bordeaux.institution | Université de Bordeaux | en_US |
bordeaux.institution | Bordeaux INP | en_US |
bordeaux.institution | CNRS | en_US |
bordeaux.conference.title | GSMM 2022 | en_US |
bordeaux.country | kr | en_US |
bordeaux.title.proceeding | 14th Global Symposium on Millimeter-Waves and Terahertz | en_US |
bordeaux.conference.city | Seoul | en_US |
bordeaux.peerReviewed | oui | en_US |
bordeaux.import.source | dissemin | |
hal.identifier | hal-03781076 | |
hal.version | 1 | |
hal.date.transferred | 2022-09-20T07:16:23Z | |
hal.export | true | |
workflow.import.source | dissemin | |
dc.rights.cc | Pas de Licence CC | en_US |
bordeaux.COinS | ctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.date=2022-05-18&rft.au=CABBIA,%20Marco&FREGONESE,%20Sebastien&YADAV,%20Chandan&ZIMMER,%20Thomas&rft.genre=proceeding |
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