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dc.rights.licenseopenen_US
dc.contributor.authorNECKEL WESLING, Bruno
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorDENG, Marina
IDREF: 184622409
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorMUKHERJEE, Chhandak
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorDE MATOS, Magali
dc.contributor.authorKUMAR, Abhishek
dc.contributor.authorLARRIEU, Guilhem
dc.contributor.authorTROMMER, Jens
dc.contributor.authorMIKOLAJICK, Thomas
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorMANEUX, Cristell
IDREF: 135213584
dc.date.accessioned2022-06-28T09:57:12Z
dc.date.available2022-06-28T09:57:12Z
dc.date.issued2022-08
dc.identifier.issn0038-1101en_US
dc.identifier.urioai:crossref.org:10.1016/j.sse.2022.108359
dc.identifier.urihttps://oskar-bordeaux.fr/handle/20.500.12278/140318
dc.description.abstractEnIn this paper, we present an improved methodology to extract the small-signal electrical equivalent circuit of the parasitic elements using RF test structures for a 3D vertical nanowire transistor technology. The methodology is based on the extraction of the distributed parasitic elements from an open structure for which on-wafer S-parameter measurements were carried out up to 40 GHz. The electrical equivalent circuit of the passive device was then used for de-embedding of the transistor S-parameters for extraction of intrinsic smallsignal parameters such as the gate capacitances.
dc.language.isoENen_US
dc.sourcecrossref
dc.subject.enTest structure
dc.subject.enEquivalent circuit
dc.subject.enParasitic components
dc.subject.enRF measurements
dc.subject.enDe-embedding
dc.title.enExtraction of small-signal equivalent circuit for de-embedding of 3D vertical nanowire transistor
dc.typeArticle de revueen_US
dc.identifier.doi10.1016/j.sse.2022.108359en_US
dc.subject.halSciences de l'ingénieur [physics]/Micro et nanotechnologies/Microélectroniqueen_US
bordeaux.journalSolid-State Electronicsen_US
bordeaux.page108359en_US
bordeaux.volume194en_US
bordeaux.hal.laboratoriesLaboratoire d’Intégration du Matériau au Système (IMS) - UMR 5218en_US
bordeaux.institutionUniversité de Bordeauxen_US
bordeaux.institutionBordeaux INPen_US
bordeaux.institutionCNRSen_US
bordeaux.peerReviewedouien_US
bordeaux.inpressnonen_US
bordeaux.import.sourcedissemin
hal.exportfalse
workflow.import.sourcedissemin
dc.rights.ccPas de Licence CCen_US
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Solid-State%20Electronics&rft.date=2022-08&rft.volume=194&rft.spage=108359&rft.epage=108359&rft.eissn=0038-1101&rft.issn=0038-1101&rft.au=NECKEL%20WESLING,%20Bruno&DENG,%20Marina&MUKHERJEE,%20Chhandak&DE%20MATOS,%20Magali&KUMAR,%20Abhishek&rft.genre=article


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