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Effect of titanium and zirconium carbide interphases on the thermal conductivity and interfacial heat transfers in copper/diamond composite materials

hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
hal.structure.identifierDepartment of Electrical Engineering
dc.contributor.authorAZINA, Clio
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorCORNU, Iñaki
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
hal.structure.identifierDepartment of Electrical Engineering
dc.contributor.authorSILVAIN, Jean-François
hal.structure.identifierDepartment of Electrical Engineering
dc.contributor.authorLU, Yongfeng
dc.contributor.authorBATTAGLIA, Jean-Luc
IDREF: 084712562
dc.date.accessioned2021-05-14T09:42:38Z
dc.date.available2021-05-14T09:42:38Z
dc.date.issued2019
dc.identifier.issn2158-3226
dc.identifier.urihttps://oskar-bordeaux.fr/handle/20.500.12278/76752
dc.description.abstractEnThermal properties of metal matrix composite materials are becoming ever more relevant with the increasing demand for thermally efficient materials. In this work, the thermal conductivity and heat transfers at the interfaces of copper matrix composite materials reinforced with diamond particles (Cu/D) are discussed. The composite materials contain either ZrC or TiC interphases and exhibit, respectively, higher and lower thermal conductivities with respect to their pure Cu/D counterparts. These thermal conductivities are accounted to the presence of strong covalent bonds and increased relative densities. The role of these interphases is also discussed regarding the phonon transmission at the interfaces.
dc.language.isoen
dc.publisherAmerican Institute of Physics- AIP Publishing LLC
dc.subject.enmetal-matrix composites (MMCs)
dc.subject.eninterface/interphase
dc.subject.enthermal properties
dc.subject.entransport phenomena analysis
dc.title.enEffect of titanium and zirconium carbide interphases on the thermal conductivity and interfacial heat transfers in copper/diamond composite materials
dc.typeArticle de revue
dc.identifier.doi10.1063/1.5052307
dc.subject.halChimie/Matériaux
dc.subject.halPhysique [physics]/Matière Condensée [cond-mat]/Science des matériaux [cond-mat.mtrl-sci]
bordeaux.journalAIP Advances
bordeaux.page055315
bordeaux.volume9
bordeaux.hal.laboratoriesInstitut de Mécanique et d’Ingénierie de Bordeaux (I2M) - UMR 5295*
bordeaux.issue5
bordeaux.institutionUniversité de Bordeaux
bordeaux.institutionBordeaux INP
bordeaux.institutionCNRS
bordeaux.institutionINRAE
bordeaux.institutionArts et Métiers
bordeaux.peerReviewedoui
hal.identifierhal-02134794
hal.version1
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-02134794v1
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=AIP%20Advances&rft.date=2019&rft.volume=9&rft.issue=5&rft.spage=055315&rft.epage=055315&rft.eissn=2158-3226&rft.issn=2158-3226&rft.au=AZINA,%20Clio&CORNU,%20I%C3%B1aki&SILVAIN,%20Jean-Fran%C3%A7ois&LU,%20Yongfeng&BATTAGLIA,%20Jean-Luc&rft.genre=article


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