Récemment ajouté

Voici les éléments 21-40 de 738

Les cookies utilisés sur ce site ne servent pas à identifier l’utilisateur mais à collecter des informations relatives à la navigation. En savoir plus…

IMS : Laboratoire de l'Intégration du Matériau au Système - UMR 5218: Dépôts récents

Investigation of different thermomechanical behaviours in one batch of QFN packages

Electromagnetic Susceptibility of a Connected System Against Intentional Electromagnetic Interferences Assessment

Towards measurements of global coefficient of thermal expansion of QFN

A 860mV and 73.5Ppm/°C Voltage Reference that Relies on Back-Gate Biasing Techniques in 28nm FD-SOI Technology

La guerre cognitive : le nouveau champ de bataille qui exploite nos cerveaux

Intégration de la gestion des compétences dans le pilotage couplé de la conception système-projet

Advanced Power Electronic Interface for Hybrid Energy Storage System

Heat dissipation measurement in flip-chip package using microfabricated temperature sensors on lid

Broadband Sub-THz Dielectric Waveguides Characterization

A 10-GHz Low Power Class-C VCO with Long-Term Reliability and Tunable Performance in 28 nm FD-SOI for Satellite Communications

IEEE Circuits and Systems Society Tour de France 2024: Celebrating 75 Years of Innovation

Temperature Compensation in FD-SOI Transistors: A Novel Approach with 27% Performance Improvement via Parasitic Diode Biasing

Twisting Effects on X-Shaped Millimeter-Wave Plastic Waveguides

Etude de l’effet d’une torsion d’un guide plastique en croix en onde millimétriques

LASCAS 2024—Solid-State Circuit Society in Latin America

THz coherent source based on light structuration using III-V semiconductor laser technology

Design of a broadband D-Band Power Amplifier

Study and development of an innovative broadband transmission architecture for 5G applications

An integrative approach to simulation model discovery: Combining system theory, process mining and fuzzy logic

MBSE with/out Simulation: State of the Art and Way Forward

IMS : Laboratoire de l'Intégration du Matériau au Système - UMR 5218: Dépôts récents

Investigation of different thermomechanical behaviours in one batch of QFN packages ﻿

Electromagnetic Susceptibility of a Connected System Against Intentional Electromagnetic Interferences Assessment ﻿

Towards measurements of global coefficient of thermal expansion of QFN ﻿

A 860mV and 73.5Ppm/°C Voltage Reference that Relies on Back-Gate Biasing Techniques in 28nm FD-SOI Technology ﻿

La guerre cognitive : le nouveau champ de bataille qui exploite nos cerveaux ﻿

Intégration de la gestion des compétences dans le pilotage couplé de la conception système-projet ﻿

Advanced Power Electronic Interface for Hybrid Energy Storage System ﻿

Heat dissipation measurement in flip-chip package using microfabricated temperature sensors on lid ﻿

Broadband Sub-THz Dielectric Waveguides Characterization ﻿

A 10-GHz Low Power Class-C VCO with Long-Term Reliability and Tunable Performance in 28 nm FD-SOI for Satellite Communications ﻿

IEEE Circuits and Systems Society Tour de France 2024: Celebrating 75 Years of Innovation ﻿

Temperature Compensation in FD-SOI Transistors: A Novel Approach with 27% Performance Improvement via Parasitic Diode Biasing ﻿

Twisting Effects on X-Shaped Millimeter-Wave Plastic Waveguides ﻿

Etude de l’effet d’une torsion d’un guide plastique en croix en onde millimétriques ﻿

LASCAS 2024—Solid-State Circuit Society in Latin America ﻿

THz coherent source based on light structuration using III-V semiconductor laser technology ﻿

Design of a broadband D-Band Power Amplifier ﻿

Study and development of an innovative broadband transmission architecture for 5G applications ﻿

An integrative approach to simulation model discovery: Combining system theory, process mining and fuzzy logic ﻿

MBSE with/out Simulation: State of the Art and Way Forward ﻿

Investigation of different thermomechanical behaviours in one batch of QFN packages

Electromagnetic Susceptibility of a Connected System Against Intentional Electromagnetic Interferences Assessment

Towards measurements of global coefficient of thermal expansion of QFN

A 860mV and 73.5Ppm/°C Voltage Reference that Relies on Back-Gate Biasing Techniques in 28nm FD-SOI Technology

La guerre cognitive : le nouveau champ de bataille qui exploite nos cerveaux

Intégration de la gestion des compétences dans le pilotage couplé de la conception système-projet

Advanced Power Electronic Interface for Hybrid Energy Storage System

Heat dissipation measurement in flip-chip package using microfabricated temperature sensors on lid

Broadband Sub-THz Dielectric Waveguides Characterization

A 10-GHz Low Power Class-C VCO with Long-Term Reliability and Tunable Performance in 28 nm FD-SOI for Satellite Communications

IEEE Circuits and Systems Society Tour de France 2024: Celebrating 75 Years of Innovation

Temperature Compensation in FD-SOI Transistors: A Novel Approach with 27% Performance Improvement via Parasitic Diode Biasing

Twisting Effects on X-Shaped Millimeter-Wave Plastic Waveguides

Etude de l’effet d’une torsion d’un guide plastique en croix en onde millimétriques

LASCAS 2024—Solid-State Circuit Society in Latin America

THz coherent source based on light structuration using III-V semiconductor laser technology

Design of a broadband D-Band Power Amplifier

Study and development of an innovative broadband transmission architecture for 5G applications

An integrative approach to simulation model discovery: Combining system theory, process mining and fuzzy logic

MBSE with/out Simulation: State of the Art and Way Forward