Recherche
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New Method to Perform TDDB Tests for Hybrid Bonding Interconnects
(2022 IEEE International Reliability Physics Symposium (IRPS), International Reliability Physics Symposium (IRPS), us, Dallas, 2022-03)Communication dans un congrès avec actes -
Evaluation of SAC solder joint thermomechanical fatigue in different types of components
(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)Communication dans un congrès avec actes -
A 5G 65-nm PD-SOI CMOS 23.2-to-28.8 GHz Low-Jitter Quadrature-Coupled Injection-Locked Digitally-Controlled Oscillator
(2022 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 2022 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), us, Denver, 2022-08-26)Communication dans un congrès avec actes -
Low Power Frequency Dividers using TSPC logic in 28nm FDSOI Technology
Communication dans un congrès -
Elaboration of a new pulsed laser system for SEE testing
Communication dans un congrès -
A 5G 65-nm PD-SOI CMOS 23.2-to-28.8 GHz Low-Jitter Quadrature-Coupled Injection-Locked Digitally-Controlled Oscillator
Communication dans un congrès