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Applications de l acoustique picoseconde à l analyse non destructive de circuits intégrés
(Colloque Interdisciplinaire en Instrumentation (C2I), FR, 2004)Communication dans un congrès avec actes -
New Method to Perform TDDB Tests for Hybrid Bonding Interconnects
(2022 IEEE International Reliability Physics Symposium (IRPS), International Reliability Physics Symposium (IRPS), us, Dallas, 2022-03)Communication dans un congrès avec actes -
Evaluation of SAC solder joint thermomechanical fatigue in different types of components
(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)Communication dans un congrès avec actes -
A 5G 65-nm PD-SOI CMOS 23.2-to-28.8 GHz Low-Jitter Quadrature-Coupled Injection-Locked Digitally-Controlled Oscillator
(2022 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 2022 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), us, Denver, 2022-08-26)Communication dans un congrès avec actes -
Low Power Frequency Dividers using TSPC logic in 28nm FDSOI Technology
Communication dans un congrès -
Selective sublimation of GaN and regrowth of AlGaN to co-integrate enhancement mode and depletion mode high electron mobility transistors
(Journal of Crystal Growth. vol. 593, pp. 126779, 2022-09-01)Article de revue