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Validation of radiation hardened designs by pulsed laser testing and SPICE analysis
(Microelectronics Reliability. vol. 39, pp. 1, 1999)Article de revue -
TRL-calibration Standards with Emphasis on Crosstalk Reduction
(14th Global Symposium on Millimeter-Waves and Terahertz, GSMM 2022, kr, Seoul, 2022-05-18)Communication dans un congrès avec actes -
A 25-50 GHz Digitally Controlled Phase-Shifter
(EuMIC 2021 - 2021 16th European Microwave Integrated Circuits Conference, 16th European Microwave Integrated Circuits Conference, EuMIC 2021, gb, Londres, 2022-04-03)Communication dans un congrès avec actes -
Signal-piloted processing metaheuristic optimization and wavelet decomposition based elucidation of arrhythmia for mobile healthcare
(Biocybernetics and Biomedical Engineering. vol. 42, n° 2, pp. 681-694, 2022-04)Article de revue -
Gas discrimination by simultaneous sound velocity and attenuation measurements using uncoated capacitive micromachined ultrasonic transducers
(Scientific Reports. vol. 12, n° 1, 2022-01-14)Article de revueLibre acceso -
Unconventional protocol for SAW sensor: multi-physic response enrichment in liquid medium
(IEEE Sensors Journal. vol. 22, n° 12, pp. 10p, 2021)Article de revue -
Application of Picosecond Ultrasonics to Non-Destructive Defect Analysis in VLSI Circuits
(Microelectronics Reliability. vol. 1, pp. 1, 2003)Article de revue -
Applications de l acoustique picoseconde à l analyse non destructive de circuits intégrés
(Colloque Interdisciplinaire en Instrumentation (C2I), FR, 2004)Communication dans un congrès avec actes -
New Method to Perform TDDB Tests for Hybrid Bonding Interconnects
(2022 IEEE International Reliability Physics Symposium (IRPS), International Reliability Physics Symposium (IRPS), us, Dallas, 2022-03)Communication dans un congrès avec actes -
Evaluation of SAC solder joint thermomechanical fatigue in different types of components
(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)Communication dans un congrès avec actes