Listar IMS : Laboratoire de l'Intégration du Matériau au Système - UMR 5218 por autor "THOMAS, Olivier"
Mostrando ítems 1-4 de 4
-
In-situ characterization of thermomechanical behavior of copper nano-interconnect for 3D integration
AYOUB, Bassel; MOREAU, Stéphane; LHOSTIS, Sandrine ...(Microelectronic Engineering. vol. 261, pp. 111809, 2022-05)Article de revue -
Thermomechanical Characterizations of Copper at Nanoscale by Laue Microdiffraction
AYOUB, Bassel; HOUSSAINI, Faycal; MOREAU, Stephane ...(Workshop Correlative Materials Characterization, Workshop Correlative Materials Characterization, de, Dresde, 2022-10)Autre communication scientifique (congrès sans actes - poster - séminaire...) -
Sub 1 μm Pitch Achievement for Cu/SiO2 Hybrid Bonding
AYOUB, Bassel; LHOSTIS, Sandrine; MOREAU, Stephane ...(24th Electronics Packaging Technology Conference, 24th Electronics Packaging Technology Conference Singapore | Dec 7-9, 2022, sg, Singapour, 2023-01-18)Communication dans un congrès avec actes -
Thermomechanical Characterizations of Copper at Nanoscale by Laue Microdiffraction
AYOUB, Bassel; LHOSTIS, Sandrine; MOREAU, Stephane ...(Satellite European School for Young Scientists Microscopy and Materials Characterization, Satellite European School for Young Scientists Microscopy and Materials Characterization, de, Dresde, 2022-10-12)Autre communication scientifique (congrès sans actes - poster - séminaire...)Libre acceso