Ka-Band AFSIW Circuit-On-Substrate for Satellite Applications
| dc.rights.license | open | en_US |
| hal.structure.identifier | Laboratoire de l'intégration, du matériau au système [IMS] | |
| dc.contributor.author | LE GALL, Maxime | |
| hal.structure.identifier | Laboratoire de l'intégration, du matériau au système [IMS] | |
| dc.contributor.author | GHIOTTO, Anthony | |
| dc.contributor.author | MARAH, Issam | |
| dc.date.accessioned | 2025-12-15T10:06:56Z | |
| dc.date.available | 2025-12-15T10:06:56Z | |
| dc.date.issued | 2025-06 | |
| dc.identifier.uri | https://oskar-bordeaux.fr/handle/20.500.12278/207966 | |
| dc.description.abstractEn | This letter demonstrates a circuit-on-substrate utilizing high-performance passive components based on the air-filled substrate-integrated waveguide (AFSIW) technology. Areceiver module, designed for space applications and operating in the satellite Ka-band frequency range, between 27.5 and 30.2GHz, is introduced. This module integrates both passive and active functions on a single multilayer printed circuit board (PCB). The passive functions include rectangular waveguide (RWG) to AFSIW transitions, circulators, loads, grounded coplanar waveguide (GCPW) to AFSIW transitions for interconnecting surface-mounted low noise amplifiers (LNAs), and a bent 8th-order bandpass filter for compactness. The design of each passive component is introduced, followed by the integration and fabrication of a demonstrator. The circuit’s performance is experimentally validated, with a gain of 35.1 ± 1.76 dB, a return loss better than 14.7 dB, and a noise figure (NF) of 4.97 ± 0.64 dB in the frequency band of interest. To the best of the authors’ knowledge, this is the first reported AFSIW circuit-on-substrate. | |
| dc.language.iso | EN | en_US |
| dc.title.en | Ka-Band AFSIW Circuit-On-Substrate for Satellite Applications | |
| dc.type | Article de revue | en_US |
| dc.identifier.doi | 10.1109/lmwt.2025.3566174 | en_US |
| dc.subject.hal | Sciences de l'ingénieur [physics] | en_US |
| bordeaux.journal | IEEE Microwave and Wireless Technology Letters | en_US |
| bordeaux.page | 788-791 | en_US |
| bordeaux.volume | 35 | en_US |
| bordeaux.hal.laboratories | IMS : Laboratoire de l'Intégration du Matériau au Système - UMR 5218 | en_US |
| bordeaux.issue | 6 | en_US |
| bordeaux.institution | Université de Bordeaux | en_US |
| bordeaux.institution | Bordeaux INP | en_US |
| bordeaux.institution | CNRS | en_US |
| bordeaux.peerReviewed | oui | en_US |
| bordeaux.inpress | non | en_US |
| bordeaux.import.source | crossref | |
| hal.popular | non | en_US |
| hal.audience | Internationale | en_US |
| hal.export | true | |
| workflow.import.source | crossref | |
| dc.rights.cc | Pas de Licence CC | en_US |
| bordeaux.COinS | ctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=IEEE%20Microwave%20and%20Wireless%20Technology%20Letters&rft.date=2025-06&rft.volume=35&rft.issue=6&rft.spage=788-791&rft.epage=788-791&rft.au=LE%20GALL,%20Maxime&GHIOTTO,%20Anthony&MARAH,%20Issam&rft.genre=article |
Files in this item
| Files | Size | Format | View |
|---|---|---|---|
|
There are no files associated with this item. |
|||