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dc.rights.licenseopenen_US
dc.contributor.authorDUMAS, Louise
dc.contributor.authorVILLENEUVE-FAURE, Christina
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorMARC, Francois
IDREF: 158656628
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorFREMONT, Helene
IDREF: 127007571
dc.contributor.authorBASCOUL, Guillaume
dc.contributor.authorGUERIN, Christophe
dc.date.accessioned2025-09-15T09:18:55Z
dc.date.available2025-09-15T09:18:55Z
dc.date.issued2025-09
dc.identifier.issn0167-9317en_US
dc.identifier.urihttps://oskar-bordeaux.fr/handle/20.500.12278/207615
dc.description.abstractEnThis paper presents the methodology to be applied in order to achieve the data retrieval of any magneto-resistive random access memory (MRAM) on the market, whether it's a Toggle MRAM or a STT-MRAM. This methodology consists of four stages: theoretical study of the structure, technological analysis to identify the physical structure of the memory, preparation of the memory to make the data accessible, and readout of those data. Knowing the structural elements and how the MRAM is read/written allows the possibility to do its technological analysis. Then, this analysis allows the identification of the magnetic tunnel junction (MTJ), where the data (‘0’ / ‘1’) is stored as resistance states, and of its surroundings, mainly the bitline. Once this is done, a complex preparation of the device's backside is achieved to expose both sides of the MTJ: one side to apply the voltage and the other to collect the current. The sample preparation methodology consists of a chemical opening, a polishing down to the transistors, focused ion beam (FIB) etches of metallization levels surrounding the MTJ and metal deposition. Finally, the memory can be read by techniques derived from atomic force microscopy (AFM). For both memory types, the discrimination of the bit states is proved by conductive AFM (C-AFM). This work demonstrates that it is possible to retrieve data stored in a Toggle MRAM (130 nm technology node) and in a STT-MRAM (40 nm technology node) using invasive techniques. These components thus represent the two types of MRAM on the market, with classical and more advanced technology nodes. The data readout validates the sample preparation flow.
dc.language.isoENen_US
dc.subject.enHardware
dc.subject.enIntegrated circuits
dc.subject.enSemiconductor memory
dc.title.enMethodology for data retrieval of MRAM: Technological analysis, sample preparation and internal electrical measurements
dc.typeArticle de revueen_US
dc.identifier.doi10.1016/j.mee.2025.112351en_US
dc.subject.halSciences de l'ingénieur [physics]en_US
bordeaux.journalMicroelectronic Engineeringen_US
bordeaux.page112351en_US
bordeaux.volume299en_US
bordeaux.hal.laboratoriesIMS : Laboratoire de l'Intégration du Matériau au Système - UMR 5218en_US
bordeaux.institutionUniversité de Bordeauxen_US
bordeaux.institutionBordeaux INPen_US
bordeaux.institutionCNRSen_US
bordeaux.teamCIRCUIT DESIGNen_US
bordeaux.teamRELIABILITYen_US
bordeaux.peerReviewedouien_US
bordeaux.inpressnonen_US
bordeaux.import.sourcecrossref
hal.identifierhal-05256347
hal.version1
hal.date.transferred2025-09-15T09:18:57Z
hal.popularnonen_US
hal.audienceInternationaleen_US
hal.exporttrue
workflow.import.sourcecrossref
dc.rights.ccPas de Licence CCen_US
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Microelectronic%20Engineering&rft.date=2025-09&rft.volume=299&rft.spage=112351&rft.epage=112351&rft.eissn=0167-9317&rft.issn=0167-9317&rft.au=DUMAS,%20Louise&VILLENEUVE-FAURE,%20Christina&MARC,%20Francois&FREMONT,%20Helene&BASCOUL,%20Guillaume&rft.genre=article


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