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dc.rights.licenseopenen_US
dc.contributor.authorMANSTRETTA, Danilo
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorRIVET, Francois
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dc.contributor.authorMIKHEMAR, Mohyee
dc.date.accessioned2025-04-15T08:18:33Z
dc.date.available2025-04-15T08:18:33Z
dc.date.issued2025-01-29
dc.identifier.urihttps://oskar-bordeaux.fr/handle/20.500.12278/206204
dc.description.abstractEnProvides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
dc.language.isoENen_US
dc.subject.enCentral Washington
dc.subject.enWork Life
dc.subject.enInternet Of Things
dc.subject.enPractical Engineering
dc.subject.enPlenary Session
dc.subject.en6G Networks
dc.subject.enPaper Award
dc.title2024 IEEE Radio Frequency Integrated Circuits Symposium in Washington, DC, USA [Conference Reports]
dc.typeArticle de revueen_US
dc.identifier.doi10.1109/mssc.2024.3489832en_US
dc.subject.halSciences de l'ingénieur [physics]en_US
bordeaux.journalIEEE Solid-State Circuits Magazineen_US
bordeaux.page136-138en_US
bordeaux.volume17en_US
bordeaux.hal.laboratoriesIMS : Laboratoire de l'Intégration du Matériau au Système - UMR 5218en_US
bordeaux.issue1en_US
bordeaux.institutionUniversité de Bordeauxen_US
bordeaux.institutionBordeaux INPen_US
bordeaux.institutionCNRSen_US
bordeaux.teamCIRCUIT DESIGN-CASen_US
bordeaux.peerReviewedouien_US
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hal.identifierhal-05034525
hal.version1
hal.date.transferred2025-04-15T08:18:35Z
hal.popularnonen_US
hal.audienceInternationaleen_US
hal.exporttrue
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dc.rights.ccPas de Licence CCen_US
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