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dc.rights.licenseopenen_US
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
hal.structure.identifierThales AVS France SAS
dc.contributor.authorLE BIHAN, Soazig
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorDUBOIS, Tristan
IDREF: 139527613
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorBEGUERET, Jean Baptiste
IDREF: 117735418
hal.structure.identifierThales AVS France SAS
dc.contributor.authorGATTI, Marc
hal.structure.identifierThales AVS France SAS
dc.contributor.authorEL ABBAZI, Adil
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
hal.structure.identifierThales AVS France SAS
dc.contributor.authorAMBLARD, Pierre
dc.date.accessioned2025-03-28T11:20:26Z
dc.date.available2025-03-28T11:20:26Z
dc.date.issued2024-05-12
dc.date.conference2024-05-12
dc.identifier.urihttps://oskar-bordeaux.fr/handle/20.500.12278/205766
dc.description.abstractEnThe design flow of a board with high-speed links can be time-consuming and requires a meticulous study of all parameters that may affect signal quality. The path of a high-speed signal passes through various structures that can create impedance discontinuities, such as BGA (Ball Grid Array), vias, AC coupling capacitors, or connectors. Poorly matched impedance can lead to unwanted signal reflections, energy losses, and electromagnetic interference. Each of these elements must be carefully analyzed to minimize the overall impact of each transition. This optimization work must take into account manufacturing constraints, frequency-dependent properties of materials, cost, as well as the reality of routing density that limits available space. An efficient methodology and design rules are developed to prepare for future designs and push the technological boundaries of aerospace products.
dc.language.isoENen_US
dc.publisherIEEEen_US
dc.subject.enSignal integrity
dc.subject.enHigh-speed links
dc.subject.enSerDes
dc.subject.enElectromagnetic 3D Models
dc.subject.enOptimization
dc.subject.enEthernet
dc.subject.enAerospace
dc.title.enMethodology for Optimizing Ethernet Links at 10 and 25 Gbps for Critical Systems in the Aerospace Environment
dc.typeCommunication dans un congrèsen_US
dc.identifier.doi10.1109/spi60975.2024.10539202en_US
dc.subject.halSciences de l'ingénieur [physics]en_US
bordeaux.page1-4en_US
bordeaux.hal.laboratoriesIMS : Laboratoire de l'Intégration du Matériau au Système - UMR 5218en_US
bordeaux.institutionUniversité de Bordeauxen_US
bordeaux.institutionBordeaux INPen_US
bordeaux.institutionCNRSen_US
bordeaux.conference.title2024 IEEE 28th Workshop on Signal and Power Integrity (SPI)en_US
bordeaux.countrypten_US
bordeaux.title.proceeding2024 IEEE 28th Workshop on Signal and Power Integrity (SPI) Proceedingsen_US
bordeaux.teamRELIABILITYen_US
bordeaux.teamCIRCUIT DESIGNen_US
bordeaux.conference.cityLisbonneen_US
bordeaux.import.sourcecrossref
hal.identifierhal-05010038
hal.version1
hal.date.transferred2025-03-28T11:20:29Z
hal.proceedingsouien_US
hal.conference.end2024-05-15
hal.popularnonen_US
hal.audienceInternationaleen_US
hal.exporttrue
workflow.import.sourcecrossref
dc.rights.ccPas de Licence CCen_US
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.date=2024-05-12&rft.spage=1-4&rft.epage=1-4&rft.au=LE%20BIHAN,%20Soazig&DUBOIS,%20Tristan&BEGUERET,%20Jean%20Baptiste&GATTI,%20Marc&EL%20ABBAZI,%20Adil&rft.genre=unknown


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